Failure Mechanism of Solder Joints of Projectile-borne Electronic Package under High Overload Environment

doi:10.12382/bgxb.2024.1006

Abstract

Abstract:

As an important part of control system for a guided projectile,the solder joints of projectile-borne electronic package will be subjected to a high overload of tens of thousands of g for several milliseconds in the chamber during launching,which is easy to cause overload damage.However,the failure analysis of solder joints of projectile-borne electronic package is difficult due to the complex loading environment in the chamber and the coupling effects of various loads.In order to research the failure mechanism of solder joints of projectile-borne electronic package with high overload,the electronic package is tested on an air cannon test platform.The mechanical responses of electronic package under different overload conditions are obtained by through the test,and the damage detection and failure analysis of electronic package are carried out.A numerical simulation model of electronic package solder joints is established and simulated to obtain the mechanical response characteristics of electronic package solder joint under high overload environment.The research results show that the stress of the solder joints in the vertical load direction is less than that in the parallel load direction,and the increase of the load amplitude will increase the solder joint stress,while the increase of the load pulse width will decrease the solder joint stress.It provides a reference for failure analysis of solder joints in projectile-borne electronic packages.

Key words: electronic package solder joint, guided projectile, high overload, numerical simulation, failure mechanism

CLC Number:

TN305.94

LIU Qiming, FAN Zhengyan, LI Tao, YANG Weilong, HAN Xu. Failure Mechanism of Solder Joints of Projectile-borne Electronic Package under High Overload Environment[J]. Acta Armamentarii, 2025, 46(9): 241006-.

Figures/Tables 26

Fig.1 Schematic diagram of air cannon test

Fig.2 Air cannon device

Fig.3 Electronic package testing device

Table 1 Test results of high overload impact response of electronic components

序号	冲击类型	传感器位置	加速度幅值/g	脉宽/ms
1	单次冲击	左端	17113	0.24
1	单次冲击	右端	26208	0.30
2	单次冲击	左端	20273	0.27
2	单次冲击	右端	27683	0.18
3	单次冲击	左端	21613	0.42
3	单次冲击	右端	24893	0.22
4	单次冲击	左端	35298	0.20
4	单次冲击	右端	43506	0.16
5	累积冲击	左端	30787-18180-12114	0.21-0.18-0.18
5	累积冲击	右端	35966-23676-18911	0.16-0.20-0.26

Fig.4 Partial overload response curve

Fig.5 Micro-computed tomography detection of circuit tube

Fig.6 Numerical model of electronic package

Table 2 Key material parameters for numerical model of electronic package[35]

序号	结构	材料	密度/ (kg·m^-3)	弹性模量/ GPa	泊松比
1	外壳	高强度钢	7860	200	0.27
2	电路筒	铝	2710	69	0.33
3	电路板	FR-4	1970	14	0.18
4	芯片	Si	2300	160	0.23
5	引脚	Cu	8900	130	0.31
6	焊点	SnAgCu	7384	54	0.36

Table 3 MOONEY-RIVLIN-RUBBER model parameters

材料	密度/ (kg·m^-3)	泊松比	常数 C₀₁/MPa	常数 C₁₀/MPa
橡胶	1150	0.499	1.50	0.50

Table 4 VISCOELASTIC model parameters

材料	密度/ (kg·m^-3)	体积模量/ GPa	初始剪切模量/GPa	长期剪切模量/GPa	衰减系数/μs
环氧树脂	1200	4.08	1.23	2.52	8.57

Table 5 Johnson-Cook model parameters[36]

参数	数值	参数	数值
A/MPa	38	m	1
B/MPa	275	T_room/K	490
C	0.0713	T_melt/K	298
n	0.71

Fig.7 Validation of numerical models for electronic package

Fig.8 The stress cloud diagram of solder joints perpendicular to the load direction

Fig.9 The maximum stress of solder joints perpendicular to load direction

Fig.10 The stress distribution of solder joint B51 perpendicular to the load direction

Fig.11 The stress on the connection surface of solder joint B51 perpendicular to the load direction

Fig.12 The stress cloud diagram of solder joints parallel to the load direction

Fig.13 The maximum stress of solder joints parallel to load direction

Fig.14 The stress distribution of solder joint B51 parallel to the load direction

Fig.15 The stress on the connection surface of solder joint B51 parallel to the load direction

Fig.16 Equivalent stress of solder joint B51 with different amplitudes

Fig.17 Equivalent plastic strain of solder joint B51 with different amplitudes

Fig.18 Dynamic response of solder joint B51 with different amplitudes

Fig.19 Equivalent stress of solder joint B51 with different pulse widths

Fig.20 Equivalent plastic strain of solder joint B51 with different pulse widths

Fig.21 Dynamic response of solder joint B51 with different pulse widths

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