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Welcome to Acta Armamentarii ! Today is
Responsible Institution: China Association for Science and Technology
Sponsor: China Ordnance Society
ISSN 1000-1093 CN 11-2176/TJ
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Failure Mechanism of Solder Joints of Projectile-borne Electronic Package under High Overload Environment
LIU Qiming, FAN Zhengyan, LI Tao, YANG Weilong, HAN Xu
Acta Armamentarii . 2025, (
9
): 241006 . DOI: 10.12382/bgxb.2024.1006
