电铸参数对铜基平面微弹簧疲劳性能的影响

doi:10.3969/j.issn.1000-1093.2016.07.013

摘要/Abstract

摘要： 平面微弹簧性能直接影响着微机电系统(MEMS)的效果和可靠性，研制长寿命的平面微弹簧对于保证微机电系统可靠性具有重要的意义。研究了占空比、电流密度、电源属性对电铸平面微弹簧质量的影响，并基于正交实验设计方法优化了工艺；制备了尺寸精度合适和疲劳性能良好的平面微弹簧，满足了MEMS的需要。研究表明：大的占空比会降低微弹簧的疲劳性能；双脉冲电源电铸的平面微弹簧疲劳性能优于直流电源和单脉冲电源电铸的；最优工艺为采用双脉冲电源、电流密度3 A/dm²、正向占空比10%；反向占空比10%. 平面微弹簧疲劳寿命在定位移0.2 mm的情况下，最大517次。

关键词: 兵器科学与技术, 平面微弹簧, 微电铸, 疲劳性能, 正交实验

Abstract: Micro-spring is an important actuating component used widely in microelectromechanical systems. It is important to develop micro-forming techniques for manufacture of micro-springs with high-fatigue life. The effects of duty cycle, current density, and power properties on the quality of micro-electroforming planar micro-springs are studied. The process is optimized using an orthogonal experiment in order to achieve the high dimensional accuracy and fatigue properties of the planar micro-springs and meet the demand of microelectromechanical systems. The result shows that the fatigue property of micro-spring decreases as the duty cycle increases. Fatigue property of planar micro-spring prepared by double pulse power is superior to the one that prepared by direct current power and single pulse power. The optimal process is to use double pulse power, 3 A/dm² current density, 10% positive duty cycle, and 10% negative duty cycle. The fatigue life of planar micro-spring can reach 517 times under the constant displacement of 0.2 mm.

Key words: ordnance science and technology, planar micro-spring, micro-electroforming, fatigue property, orthogonal experiment

中图分类号:

TQ153.4

Cao Quoc Dinh, 徐宁, 李成园，张新平. 电铸参数对铜基平面微弹簧疲劳性能的影响[J]. 兵工学报, 2016, 37(7): 1252-1257.

CAO Quoc Dinh, XU Ning, LI Cheng-yuan, ZHANG Xin-ping. Effects of Electroforming Parameters on Fatigue Properties of Cu-based Planar Micro-spring[J]. Acta Armamentarii, 2016, 37(7): 1252-1257.

参考文献

［1］ Sung W L, Lai W C, Chen C C, et al. Micro devices integration with large-area 2D chip-network using stretchable electroplating copper spring ［C］∥Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems. San Francisco, US: IEEE Robotics and Automation Society, 2014:1135-1138.
［2］ Miller R A, Tai Y C . Micro-machined electromagnetic scanning mirrors ［J］. Optical Engineering, 1997, 36(5):1399-1407.
［3］ Youn S W, Takahashi M, Goto H,et al. Fabrication of micro-mold for glass embossing using focused ion beam, femto-second laser, eximer laser and dicing techniques ［J］. Journal of Materials Processing Technology, 2007, 187(4):326-330.
［4］ Jing X M, Chen D, Fang D M, et al. Multi-layer microstructure fabrication by combining bulk silicon micromachining and UV-LIGA technology ［J］. Microelectronics Journal, 2007, 38(1): 120-124.
［5］冯鹏洲,朱继南,吴志亮,等. 美国典型MEMS引信安全保险装置分析［J］. 探测与控制学报, 2007, 29(5): 26-30,33.
FENG Peng-zhou, ZHU Ji-nan, WU Zhi-liang, et al. Analysis of US typical MEMS fuze safety and arming device［J］. Journal of Detection and Control, 2007, 29(5): 26-30, 33. (in Chinese)
［6］黄新龙,熊瑛,陈光焱,等. UV-LIGA技术制作微型螺旋形加速度开关［J］. 光学精密工程, 2010, 18(5):1152-1158.
HUANG Xin-long, XIONG Ying, CHEN Guang-yan, et al. Fabrication of micro spiral acceleration switch using UV-LIGA technology ［J］.Optics and Precision Engineering, 2010, 18(5):1152-1158. (in Chinese)
［7］ Saotome Y, Yokote S, Okamato T, et al. Design and insitu mechanical testing system for probe card/ UV-LIGA-Ni microspring［C］∥Proceedings of the Sixteenth Annual International Conference on Micro Electro Mechanical Systems. Kyoto, Japan: IEEE Robotics and Automation Society, 2003: 670-673.
［8］冯鹏洲. 微机电安全与解除保险装置关键技术研究［D］. 南京:南京理工大学, 2008.
FENG Peng-zhou. Research on the key technology of MEMS fuze safety & arming device ［D］. Nanjing: Nanjing University of Science and Technology, 2008. (in Chinese)
［9］ Saito N, Murata N, Tamakawa K, et al. Evaluation of the crystallinity of grain boundaries of electronic copper thin films for highly reliable interconnections ［C］∥Proceedings of IEEE 62nd Electronic Components and Technology Conference. San Diego, US: Institute of Electrical and Electronics Engineers, 2012:1153-1158.
［10］ Zhang S D, Sakane M, Nagasawa T, et al. Mechanical properties of copper thin films used in electronic devices ［J］. Procedia Engineering, 2011, 10(7):1497-1502.
［11］苏飞,张铮,熊吉,等. 电镀铜薄膜力学性能的实验研究［J］. 实验力学,2012,27(5):565-569.
SU Fei, ZHANG Zheng, XIONG Ji, et al. Experimental study of mechanical properties for electroplated copper film ［J］. Journal of Experimental Mechanics, 2012, 27(5):565-569. (in Chinese)
［12］关丽雅,郑秀华,王富耻,等. 脉冲参数对电铸铜组织形态和硬度的影响［J］. 电镀与精饰,2008,30(6):1-5.
GUAN Li-ya, ZHENG Xiu-hua, WANG Fu-chi, et al. Influence of pulse parameters on the structure and hardness of electroforming copper ［J］. Plating and Finishing, 2008, 30(6):1-5. (in Chinese)
［13］邵伟平,张继桃,郝永平,等. 基于MEMS镍平面微弹簧尺寸误差分析［J］. 机械设计,2012,29(8):80-82.
SHAO Wei-ping, ZHANG Ji-tao, HAO Yong-ping, et al. Analysis of dimension tolerance for MEMS Ni planar micro spring ［J］. Journal of Machine Design, 2012, 29(8):80-82. (in Chinese)
［14］李华,石庚辰,何光. MEMS加工误差对微弹簧力学特性的影响分析［J］. 压电与声光,2009,31(5):735-737.
LI Hua, SHI Geng-chen, HE Guang. Analysis of effect of MEMS fabrication error on the microspring mechanical property ［J］. Piezoelectrics and Acoustooptics, 2009, 31(5):735-737. (in Chinese)
［15］石庚辰,李华. 基于LIGA(准LIGA)工艺的微机械零件公差问题［J］. 功能材料与器件学报,2008,14(2):380-383.
SHI Geng-chen, LI Hua. Tolerance of MEMS part based on LIGA (quasi- LIGA) technology ［J］. Journal of Functional Materials and Devices, 2008, 14(2):380-383. (in Chinese)
［16］ Ruzzu A, Matthis B. Swelling of PMMA-structures in aqueous solutions and room temperature Ni-electroforming ［J］. Microsystem Technologies, 2002, 8(2):116-119.
［17］徐良朗. 超细晶铜的电铸工艺优化研究［D］.南京:南京理工大学,2006.
XU Liang-lang. Study on optimization of electroforming process of ultrafine grained copper ［D］.Nanjing:Nanjing University of Science and Technology, 2006. (in Chinese)
［18］邵力耕. 脉冲微纳米电铸相关问题的研究［D］. 大连:大连理工大学,2011.
SHAO Li-geng. Research on pulse micro-nano electroforming relevant questions ［D］. Dalian: Dalian University of Technology, 2011. (in Chinese)
［19］易光斌. 电解铜箔组织性能及其翘曲产生机理研究［D］. 南昌:南昌大学,2014.
YI Guang-bin. Mechanism on warping and microstructure and mechanical properties of electrolytic copper foils ［D］. Nanchang: Nanchang University, 2014. (in Chinese)
［20］吕欣蕊. 电沉积铜箔的工艺参数和拉伸性能研究［D］. 天津:天津大学,2010.
LYU Xin-rui. Study on processing parameters and tensile properties of electrodeposited copper foil ［D］. Tianjin: Tianjin University, 2010. (in Chinese)
［21］徐惠宇,朱荻,曲宁松. 电铸沉积层性能的试验研究［J］.电加工与模具,2001(1):18-20.
XU Hui-yu, ZHU Di, QU Ning-song. Experimental study of properties for electroforming deposition layer ［J］. Electromachining and Mould, 2001(1):18-20. (in Chinese)
［22］刘仁志. 实用电铸技术［M］. 北京：化学工业出版社, 2007.
LIU Ren-zhi. Practical electroforming technology ［M］.Beijing: Chemical Industry Press, 2007. (in Chinese)
［23］ Chen F, Chen S, Dong X H, et al. Size effects on tensile strength of aluminum-bronze alloy at room temperature［J］. Materials and Design, 2015, 85:778-784.

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