Research on Distribution Uniformity of Electroformed Metal Layer by Using Hollow Square Cathode-shielding Plate

doi:10.3969/j.issn.1000-1093.2016.06.015

Abstract

Abstract: A modified electroforming approach is proposed to further improve the thickness uniformity of electroformed pieces with large areas. The proposed approach involves the addition of a hollow square cathode-shielding plate to the cathode which translates circumferentially. Some simulations and experiments were carried out to study the proposed method. The research results show that both geometrical feature parameters and placement positions of hollow square cathode-shielding plate have great effects on the cathode current density distribution. The thickness distribution of deposited metal can be significantly improved using the modified process in which thickness deviation of less than 8% is achieved for 100 μm thick deposit (70 mm×70 mm). The proposed electroforming approach is expected to provide an upgraded alternative for preparing the considerably uniform large-area flat electroformed layers.

Key words: manufacturing technology and equipment, electroforming, thickness distribution uniformity, cathode shielding plate, cathode circumferential translation

CLC Number:

TQ153.4

LI Hui-juan, MING Ping-mei, ZHOU Tao, ZHAO Yun-long, QIN Ge. Research on Distribution Uniformity of Electroformed Metal Layer by Using Hollow Square Cathode-shielding Plate[J]. Acta Armamentarii, 2016, 37(6): 1075-1081.

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