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Acta Armamentarii ›› 2016, Vol. 37 ›› Issue (7): 1252-1257.doi: 10.3969/j.issn.1000-1093.2016.07.013

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Effects of Electroforming Parameters on Fatigue Properties of Cu-based Planar Micro-spring

CAO Quoc Dinh, XU Ning, LI Cheng-yuan, ZHANG Xin-ping   

  1. (School of Material Science and Engineering, Nanjing University of Science and Technology,
  • Received:2015-11-05 Revised:2015-11-05 Online:2016-09-05
  • Contact: CAO Quoc Dinh E-mail:gaoguoding90@gmail.com

Abstract: Micro-spring is an important actuating component used widely in microelectromechanical systems. It is important to develop micro-forming techniques for manufacture of micro-springs with high-fatigue life. The effects of duty cycle, current density, and power properties on the quality of micro-electroforming planar micro-springs are studied. The process is optimized using an orthogonal experiment in order to achieve the high dimensional accuracy and fatigue properties of the planar micro-springs and meet the demand of microelectromechanical systems. The result shows that the fatigue property of micro-spring decreases as the duty cycle increases. Fatigue property of planar micro-spring prepared by double pulse power is superior to the one that prepared by direct current power and single pulse power. The optimal process is to use double pulse power, 3 A/dm2 current density, 10% positive duty cycle, and 10% negative duty cycle. The fatigue life of planar micro-spring can reach 517 times under the constant displacement of 0.2 mm.

Key words: ordnance science and technology, planar micro-spring, micro-electroforming, fatigue property, orthogonal experiment

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