Research Progress of Transient Photoelectric Measurement Technology for Shock Wave and Detonation Physics Experiments

doi:10.12382/bgxb.2023.0361

Abstract

Abstract:

Shock wave physics and detonation physics is the key basis for detonation device physical design, engineering design and effect research, and are focused on researching the mechanical response, effect and engineering technology application of medium, materials and structures under strong dynamic loads such as explosion, shock and transient energy deposition. The advanced transient photoelectric measurement technology for extreme environments is an important driving force for the research and development of shock wave physics and detonation physics. Based on the current situation of transient photoelectric measurement technology for shock wave and detonation experiments at home and abroad, the characteristics and typical technical parameters of the main techniques, such as high-speed photography, X-ray flash photography, holographic imaging, transient pyrometer and Doppler velocimetries, are summarized. The development trend of these techniques is analyzed, which provides some references for the development of transient photoelectric measurement technology for shock wave and detonation experiments in China.

Key words: shock wave physics, detonation physics, transient, imaging, spectroscopy, interferometer, photoelectric measurement technology

CLC Number:

TH74

DU Liangliang, QIAN Weixin, LIU Shouxian, ZHAO Yu, LI Shengfu, ZHAI Zhaohui, CHANG Lihua, ZHU Yu, WENG Jidong, WU Jian, LI Jun, ZHU Liguo. Research Progress of Transient Photoelectric Measurement Technology for Shock Wave and Detonation Physics Experiments[J]. Acta Armamentarii, 2023, 44(12): 3622-3640.

Figures/Tables 31

Fig.1 Optical schematic diagram of high speed rotating mirror framing/streak camera

Fig.2 Schematic diagram of ultrahigh-speed optic electronic framing camera

Fig.3 Schematic diagram of image converter streak camera

Table 1 Technical parameters of OEFC-16F optic electronic framing camera

参数	数值
光谱响应范围/nm	380~830
最高摄影频率(实测)/(帧·s^-1)	2×10⁸
最短曝光时间/ns	1
空间分辨率/(线对·mm^-1)	≥45
通道数	16(可调)
双曝光模式记录幅数	16~32

Table 2 Technical parameters of OESC-5PS image converter streak camera

参数	数值
光谱响应范围/nm	300~810
静态空间分辨率/(线对·mm^-1)	30
时间分辨力/ps	≤3
扫描非线性度/%	≤±2
扫描速度	500ps~1ms(可调)

Table 3 Technical parameters of optic electronic simultaneous framing/streak camera

类型	参数	数值
	光谱响应范围/nm	380~830
	记录幅数	8幅,可调
分幅特性	最高摄影频率/(帧·s^-1)	2×10⁸
	最短曝光时间/ns	5
	最小画幅间隔/ns	1
	空间分辨率/(线对·mm^-1)	45
	时间分辨力/ps	≤5
扫描特性	记录长度/ns	0.5~400(可调)
	空间分辨率/(lp·mm^-1)	≥30

Fig.4 2D images of underwater-explosion shock wave propagation

Fig.5 Images of high-speed projectile impacting on target illuminated by laser

Fig.6 Cylindrical quasi-isentropic compression process under laser illumination

Fig.7 Schematic diagram of X-ray flash radiography system

Fig.8 Schematic diagram of pixelated scintillator array

Fig.9 Dynamic process of perforation ejection flow formation

Fig.10 Schematic diagram and typical result of dual-wavelength optical holographybased on wavelength multiplexing (thin holograms)

Fig.11 Diagnosis of laser loaded dynamic fragmentation results by transient multi-frame volume holography

Fig.12 Key information provided from dual exposure in-line digital holography

Fig.13 Schematic layout of eight-wavelength pyrometer visible light-infrared optical

Table 4 Technical parameters of transient 2-D pyrometer

参数	超高速模式	高速连续模式
温度测量幅数	1,2,4,8	>10000
工作波长数	4	1~6
视场	ϕ30mm	ϕ50m@200m测距
物方分辨力	~100μm	<0.1m@200m测距
温度场点阵	300×300	~1024×1024
测温范围/K	2000~10000	2000~10000
最小曝光时间	10ns	~1μs
最小幅间隔	10ns	~10μs

Fig.14 2D temperature measured results

Fig.15 The principles of laser Doppler velocimeter

Table 5 Technical parameters of developed PDV systems

技术指标	CAEP-PDV-Ⅱ	CAEP-PDV-Ⅲ	MPDV
激光波长/nm	~1550	~1550	~1550
光斑直径/μm	10~1000	10~1000	10~1000
测速点数/(点·台^-1)	1~8	1~8	32~56
测速范围/(km·s^-1)	0~10	0~20 (-n~(10-n)km)	0~10
测速不确定度/%	≤1	≤1	≤1
测量距离	0.1mm~10m	0.1mm~10m	0.1mm~10m
时间分辨/ns	1	1	1

Fig.16 Test results of MPDV

Fig.17 Reconstruction of flyer planarity by Micro-PDV

Table 6 Technical parameters of developed VISAR systems

技术指标	线成像VISAR	面成像VISAR
激光波长/nm	532	532
成像视场/mm	1~15	ϕ1~ϕ15
空间分辨/μm	5	2
测速范围/(m·s^-1)	15~20000	15~20000
测速分辨/(m·s^-1)	15~60	15~60
测量距离	0.1mm~10m	0.1mm~10m
时间分辨	10ps	200ps或5ns

Fig.18 Experimental results of imaging VISAR of laser driven flyer

Fig.19 Schematic diagram of TDV system (dashed box) and the detonation testing field

Table 7 Specification of TDV system

参数	数值	备注
穿透炸药厚度/mm	≥30	少数>80
工作频段/THz	0.22、0.34、0.67
测速范围/(km·s^-1)	0.1~20
位移分辨率	≤10μm

Fig.20 Method of reading shock-to-detonation transition position by TDV system

Fig.21 Experimental system for the burn rate of explosive and xperimental result under high pressure

Fig.22 Schematic diagram of frequency domain interferometry system based on geometric optical components

Fig.23 Sketch diagram of OFDI system

Fig.24 Sketch diagram of DFDI system

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