关键词: 电子封装焊点, 制导炮弹, 高过载, 数值模拟, 失效机理

Abstract: As an important part of the control system of guided projectile, the missile-borne electronic package solder joint can withstand high overload of tens of thousands of g and several milliseconds when launched in the chamber, which is easy to cause overload damage. However, the failure analysis of missile-borne electronic package solder joints is difficult due to the complex loading environment in the chamber and the coupling effects of various loads.In order to research the failure mechanism of the solder joint of projectile-borne electronic package with high overload, the mechanical response of electronic package under different overload conditions is obtained by using the air cannon test platform, and the damage detection and failure analysis of electronic package are carried out. The numerical simulation model of electronic package solder joint is established and simulated to obtain the mechanical response characteristics of electronic package solder joint under high overload environment. The research results show that the stress of the solder joint in the vertical load direction is less than that in the parallel load direction, and the increase of the load amplitude will increase the solder joint stress, while the increase of the load pulse width will decrease the solder joint stress. It provides a reference for failure analysis of solder joints in missile-borne electronic packages.

Key words: electronic package solder joints, guided projectile, high overload, numerical simulation, failure mechanism