[1] 杨福兴. 大口径平面光学元件超精密加工技术的研究[J]. 光学技术,2004,1:27-29. YANG Fu-xing. Large diameter plane optical element ultra-precision processing technology[J]. Optical Technique, 2004,1:27-29. (in Chinese) [2] Huang H, Guo Y B. Research on aspheric machining system error compensation and experiment eliminate the error wave area[J]. International Journal of Computer Applications Technology, 2007, 29(7): 150-154. [3] Zhan Jian-ming, Yu Si-hai. Study on error compensation of machining force in aspheric surfaces polishing by profile-adaptive hybrid movement-force control[J]. International Journal of Advanced Manufacturing Technology, 2011, 54: 879-885. [4] Sazedur Rahman M, Saleh T, Lim H S, et al. Development of an on-machine profile measurement system in ELID grinding for machining aspheric surface with software compensation[J]. International Journal of Machine Tools & Manufacture, 2008, 48: 887-895. [5] Li Y, Gracewski S M, Funkenbusch P D, et al. Analysis of chatter in contour grinding of optical materials[J]. International Journal of Machine Tools & Manufacture, 2002,42: 1095-1103. [6] 张翊, 郭隐彪, 庄司克雄. 微小振动影响超精密非球面加工精度的研究[J]. 金刚石与磨料磨具工程, 2003, (3): 17-20. ZHANG Yi, GUO Yin-biao, Syoji Katsuo. Influence of chatter vibration on the ultra precision machining accuracy of aspheric surface [J]. Diamond and Abrasives Engineering, 2003,(3): 17-20. (in Chinese) [7] 杨小璠, 郑琳, 郭隐彪. 超精密磨削加工微小振动模拟系统研究[J]. 组合机床与自动化加工技术, 2004,(6):17-20. YANG Xiao-fan, ZHENG Lin, GUO Yin-biao. Ultra-precision grinding machining small vibration simulation system research[J]. Modular Machine Tool & Automatic Manufacturing Technique, 2004,(6):17-20. (in Chinese) [8] 吴剑锋, 王文, 陈子辰. 激光三角法测量误差分析与精度提高研究[J]. 机电工程, 2003,5:89-91. WU Jian-feng, WANG Wen, CHEN Zi-chen. Laser triangulation measurement error analysis and the accuracy enhance [J]. Journal of Mechanical and Electrical Engineering, 2003,5: 89-91. (in Chinese) [9] Usanov D A, Skripal A V. Quantum Electronics Measurement of micro- and nanovibrations and displacements using semiconductor laser autodynes[J]. Quantum Electronics, 2011,41(1): 86-94. |