基于光滑粒子流体动力学法单颗磨粒超声辅助磨削陶瓷材料的磨削力仿真研究

doi:10.3969/j.issn.1000-1093.2015.06.015

兵工学报 ›› 2015, Vol. 36 ›› Issue (6): 1067-1073.doi: 10.3969/j.issn.1000-1093.2015.06.015

基于光滑粒子流体动力学法单颗磨粒超声辅助磨削陶瓷材料的磨削力仿真研究

米召阳，梁志强，王西彬，周天丰，赵文祥，田梦

(北京理工大学先进加工技术国防重点学科实验室, 北京 100081)

收稿日期:2014-08-19 修回日期:2014-08-19 上线日期:2015-08-03
通讯作者: 米召阳 E-mail:kuziying@163.com
作者简介:米召阳(1989—)，男，硕士研究生
基金资助:
国家自然科学基金项目( 51205024)；北京理工大学基础研究基金项目(20130342024)

A Simulation Investigation on Grinding Forces in Ultrasonic Assisted Grinding of Ceramics with Single Abrasive Grain byUsing SPH Method

MI Zhao-yang， LIANG Zhi-qiang， WANG Xi-bin， ZHOU Tian-feng， ZHAO Wen-xiang， TIAN Meng

(Key Laboratory of Fundamental Science for Advanced Machining, Beijing Institute of Technology, Beijing 100081, China)

Received:2014-08-19 Revised:2014-08-19 Online:2015-08-03
Contact: MI Zhao-yang E-mail:kuziying@163.com

摘要/Abstract

摘要： 为了揭示轴向超声振动对磨削SiC陶瓷、Al₂O₃陶瓷的磨削力影响机制，利用光滑粒子流体动力学（SPH）法对单颗金刚石磨粒磨削SiC陶瓷、Al₂O₃陶瓷的磨削力进行仿真，提出在单颗磨粒模拟磨削中应将平均未变形切屑厚度作为磨削深度。通过分析轴向超声振动振幅与磨粒速度对平均未变形切屑厚度的影响，发现平均未变形切屑厚度随着超声振动振幅的增加而减小、随着磨粒速度的降低而减小。仿真结果表明：与普通磨削（CG）相比，轴向超声振动能够有效降低磨削力；随着超声振动振幅的增加磨削力降低比率增大；在相同磨削参数下，磨粒切削SiC陶瓷时磨削力大于切削Al₂O₃陶瓷的磨削力。

关键词: 机械制造工艺与设备, 超声辅助磨削, 平均未变形切屑厚度, 光滑质点流体动力学法, SiC陶瓷, Al₂O₃陶瓷

Abstract: In order to investigate the influence of axial ultrasonic vibration on the grinding force during ultrasonic assisted grinding (UAG) of SiC and Al₂O₃ ceramics, the grinding forces of UAG SiC and Al₂O₃ ceramics with single diamond abrasive grain are simulated by using smoothed particle hydrodynamic (SPH) method. In the simulation，the average undeformed chip thickness is set as the depth of cut. It is found that the average undeformed chip thickness decreases with the increase in ultrasonic amplitude and the decrease in abrasive velocity. The simulation results of grinding forces show that the assistance of axial ultrasonic vibration can effectively reduce the grinding forces，and the higher ultrasonic amplitude has a positive effect on the decrease in grinding forces compared with that during conventional grinding. Under the same grinding parameters，the grinding forces in the grinding of SiC ceramics are larger than those in the grinding of Al₂O₃ ceramics.

Key words: manufaturing technology and equipment, ultrasonically assisted grinding, undeformed chip thickness, smoothed particle hydrodynamic method, SiC ceramics, Al₂O₃ ceramics

中图分类号:

TG580.1⁺3

米召阳，梁志强，王西彬，周天丰，赵文祥，田梦. 基于光滑粒子流体动力学法单颗磨粒超声辅助磨削陶瓷材料的磨削力仿真研究[J]. 兵工学报, 2015, 36(6): 1067-1073.

MI Zhao-yang， LIANG Zhi-qiang， WANG Xi-bin， ZHOU Tian-feng， ZHAO Wen-xiang， TIAN Meng. A Simulation Investigation on Grinding Forces in Ultrasonic Assisted Grinding of Ceramics with Single Abrasive Grain byUsing SPH Method[J]. Acta Armamentarii, 2015, 36(6): 1067-1073.

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基于光滑粒子流体动力学法单颗磨粒超声辅助磨削陶瓷材料的磨削力仿真研究

A Simulation Investigation on Grinding Forces in Ultrasonic Assisted Grinding of Ceramics with Single Abrasive Grain byUsing SPH Method

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