[1] 蔡一湘,刘伯武. 钨铜复合材料致密化问题和方法[J]. 粉末冶金技术,1999,17(2):138-144. CAI Yi-xiang, LIU Bo-wu. Problems and solutions in densification of W-Cu composite[J]. Powder Metallurgy Technology, 1999, 17(2): 138-144. (in Chinese) [2] 范景莲,严德剑,黄伯云,等. 国内外钨铜复合材料的研究现状[J]. 粉末冶金工业,2003,13(2):9-14. FAN Jing-lian, YAN De-jian, HUAN Bo-yun, et al. Current status of R&D of W-Cu composite materials in China and abroad[J]. Powder Metallurgy Industry, 2003, 13(2): 9-14. (in Chinese) [3] 周武平, 吕大铭. 钨铜材料应用和生产的发展现状[J]. 粉末冶金材料科学与工程,2005,10(1):21-25. ZHOU Wu-ping, LYU Da-ming. Development of application and production in W-Cu materials [J]. Materials Science and Engineering of Powder Metallurgy,2005,10(1):21-25. (in Chinese) [4] 刘美芬,张朝晖,李树奎,等. 压缩变形对钨渗铜合金微观组织及性能的影响[J]. 兵器材料科学与工程,2005,28(3):11-13. LIU Mei-fen, ZHANG Zhao-hui, LI Shu-kui, et al. Effect of compressive deformation on microstructures and properties of infiltrated W-Cu composites[J]. Ordnance Materials Science and Engineering, 2005, 28(3): 11-13. (in Chinese) [5] 刘辉明,范景莲,刘涛,等. 细晶W-Cu合金的高温拉伸力学行为与组织演变[J]. 中国钨业,2011,26(1):38-40. LIU Hui-ming, FAN Jing-lian, LIU Tao, et al. High temperature tensile mechanical behavior and microstructural change of fine-grained W-Cu alloys[J]. China Tungsten Industry, 2011, 26(1): 38-40. (in Chinese) [6] 长崎诚三,平林真. 二元合金状态图集[M].刘安生,译. 北京:冶金工业出版社,2004:239. Seizo N, Makoto H. Binary alloy phase-diagrams[M]. LIU An-sheng,translated. Beijing: Metallurgical Industry Press,2004: 239. (in Chinese) [7] 张振华.金属粉体表面改性综述[J]. 科技信息,2011(28):385. ZHANG Zhen-hua. Review of metal powder surface modification [J]. Science & Technology Information, 2011(28): 385. (in Chinese) [8] Zanggeneh K, Amirjan M, Parvin N. Improvement of physical properties of Cu-infiltrated W compacts via electroless nickel plating of primary tungsten powder[J]. Surface and Coatings Technology,2009, 203(16):2333-2336. [9] 李钒,夏定国,王习东. 化学镀的物理化学基础与实验设计[M]. 北京:冶金工业出版社,2011:2-3. LI Fan, XIA Ding-guo, WANG Xi-dong. Theory of physical chemistry and design of experiment for chemical plating[M]. Beijing:Metallurgical Industry Press,2011: 2-3. (in Chinese) [10] 李均明,薛晓楠,蔡辉,等. 多孔结构MgO表面化学镀Ni层的制备与表征[J]. 金属学报,2010,46(9):1103-1108 . LI Jun-ming, XUE Xiao-nan, CAI Hui, et al. Preparation an characterization of electroless Ni coating on the surface of MgO with porous structure[J]. Acta Metallurgica Sinica, 2010, 46(9): 1103-1108. (in Chinese) [11] 赵雯,张秋禹,王结良,等. 无机粉体化学镀镍的研究进展[J]. 电镀与涂饰,2004,23(3):33-35. ZHAO Wen, ZHANG Qiu-yu, WANG Jie-liang, et al. Progress of electroless nickle plating on inorganic powder[J]. Electroplating & Finishing, 2004, 23(3): 33-35. (in Chinese) [12] Luo L M, Yu J, Luo J, et al. Preparation and characterization of Ni-coated Cr3C2 powder by room temperature ultrasonic-assisted electroless plating[J]. Ceramics International, 2010, 36: 1989- 1992. [13] Luo L M, Wu Y C, LI J, et al. Preparation of nickel-coated tungsten carbide powders by room temperature ultrasonic-assisted electroless plating[J]. Surface & Coatings Technology, 2011, 206: 1091-1095. [14] 张丽民,李惠琪,孙玉宗,等. WC颗粒表面超声波化学镀镍工艺[J]. 金属热处理,2004,29(11):40-43. ZHANG Li-min, LI Hui-qi,SUN Yu-zong,et al. Ultrasonic electroless nickle plating on the surface of WC particles[J]. Heat Treatment of Metals, 2004, 29(11): 40-43. (in Chinese) [15] 屈战民. 石墨粉末化学镀镍及化学镀银工艺[J]. 电镀与精饰,2007,29(6):24-27. QU Zhan-min. Technology of electroless nickle and electroless silver on graphite powders[J]. Plating and Finishing, 2007, 29(6): 24-27. (in Chinese) [16] 胡文斌,刘磊,仵亚婷. 难镀基材的化学镀镍技术[M]. 北京:化学工业出版社,2003:19-22. HU Wen-bin, LIU Lei, WU Ya-ting. Technology of electroless nickle on hard coating substrate[M]. Beijing:Chemical Industry Press,2003: 19-22. (in Chinese) [17] 刘长久,李文科,刁汉明. 低温化学镀Ni-Cu-P三元合金工艺[J]. 桂林工学院学报,1999,19(2):176-178. LIU Chang-jiu, LI Wen-ke, DIAO han-ming.Technologic on electroless plating of Ni-Cu-P alloy in low temperature[J]. Jour- nal of Guilin Institute of Technology, 1999, 19(2): 176-178. (in Chinese) [18] 吴岩青,郭润秀. 络合滴定法连续测定钨镍铜合金中的镍铜[J]. 理化检测-化学分册,1998,34(11):494-495. WU Yan-qing, GUO Run-xiu. Consecutive determination of copper and nickel in W-Ni-Cu alloy by complexometric titration[J]. Chemical Analysis, 1998, 34(11): 494-495. (in Chinese) [19] 姜晓霞,沈伟. 化学镀理论及实践[M]. 北京:国防工业出版社,2000:18. JIANG Xiao-xia, SHEN Wei. The fundamentals and practice of electroless plating[M]. Beijing:National Defense Industry Press,2000: 18. (in Chinese) [20] 蔡晓兰,黄鑫,刘志坚. 化学镀镍溶液中络合剂对镀速影响的研究[J]. 吉林化工学院学报,2000,17(4):21-23. CAI Xiao-lan, HUANG Xin, LIU Zhi-jian. Effect of complexing agent on plating rate in electroless nickle solution[J]. Journal of Jinlin Institute of Chemical Technology, 2000, 17(4): 21-23. (in Chinese) [21] Amir A A, Soheila F, Sepideh A I, et al. The study of electroless Ni-P alloys with different complexing agents on Ck45 steel substrate[J]. [EB/OL].[2013-05-29].www.science direct.com/science/artice/pii/s1878535213001354. [22] 段志伟,张振忠,陆春华,等. 化学镀法制备Cu包覆纳米Al2O3粉末[J]. 表面技术,2006,35(3):11-13. DUAN Zhi-wei, ZHANG Zhen-zhong, LU Chun-hua, et al. Preparation of Cu-Al2O3 composite powder by electroless copper plating[J]. Surface Technology, 2006, 35(3): 11-13. (in Chinese) [23] Panadda N, Hathaipat K. Phase transformation of NiCrBSi-WC and NiBSi-WC arc sprayed coatings[J]. Surface & Coatings Technology 2011, 206: 440-445. [24] Zemanová M, Krivosudská M, Chovancová M. et al. Pulse current electrodeposition and corrosion properties of Ni-W alloy coatings[J]. Journal of Applied Electrochemistry, 2011, 41(9): 1077-1085. [25] Johnson J L, German R M. Phase equilibrium effects on the enhanced liquid phase sintering of tungsten-copper[J]. Metallurgical Transactions A, 1993, 24A(11): 2369-2377. |