[1] Lee H S, Jeong H D. A wafer-scale material removal rate profile model for copper chemical mechanical planarization[J]. International Journal of Machine Tools & Manufacture, 2011, 51:395-403. [2] Wang D, Lee J, Holland K, et al. Von Misses stress in chemical-mechanical polishing processes [J]. Journal of the Electrochemical Society,1997, 144(3):1122-1127. [3] Fu G, Chandra A. The relationship between wafer surface pressure and wafer backside loading in chemical mechanical polishing [J]. Thin Solid Films, 2005, 474(1-2):217- 221. [4] Tsai M Y, Yan L W. Characteristics of chemical mechanical polishing using graphite impregnated pad [J]. International Journal of Machine Tools & Manufacture, 2010, 50:1031-1037. [5] Lo S P, Lin Y Y, Huang J C. Analysis of retaining ring using finite element simulation in chemical mechanical polishing process [J]. The International Journal of Advanced Manufacturing Technology,2007, 34(5-6):547-555. [6] Wei C C, Horng J H, Lee A C,et al. Analyses and experimental confirmation of removal performance of silicon oxide film in the chemical-mechanical polishing (CMP) process with pattern geometry of concentric groove pads [J]. Wear, 2011, 270(3-4):172-180. [7] Hayashi Y, Nakajima T, Kunio T. Ultrauniform chemical mechanical polishing using a “Hydro Chuck” featured by wafer mounting on a quartz class plate with fully flat, water-supported surface [J]. Journal of Applied Physics, 1996, 35(2B):1054-1059. [8] Dempsey J P, Zhao Z G, Li H. Axisymmetric indentation of an elastic layer supported by a Winkler foundation [J]. International Journal of Solids Structures, 1991, 27(1):73-87. [9] Richter P H, Rudi S. Leaf arrangement: geometry, morphogenesis and classification [J]. Naturwissen Schaften, 1978, (65):319-327. [10] Jean R V. Phyllotaxis [M]. Cambridge: Cambridge University Press, 1994. [11] 王武刚.仿生表面结构研磨盘与抛光垫的若干研磨抛光问题的研究[D].沈阳:沈阳理工大学,2009. WANG Wu-gang. Some researches on lapping and polishing with bionic plate and pad [D]. Shenyang: Shenyang Ligong University, 2009.(in Chinese) [12] Saeed Moaveni. Finite element analysis theory and application with ANSYS [M]. Beijing: Publishing House of Electronics Industry, 2003. [13] White D, Melvin J, Boning D. Characterization and dynamic modeling of thermal behavior in chemical mechanical polishing [J]. Journal of the Electrochemical Society, 2003, 150(4): 271-278. [14] Preston F W. The theory and design of plate glass polishing machine [J]. Journal of the Society of Glass Technology, 1927,(11): 214-256. |