Research on Exploding Foil Initiator Based on Non-silicon MEMS Technology

doi:10.3969/j.issn.1000-1093.2017.02.008

Abstract

Abstract: The non-silicon MEMS manufacturing technology of exploding foil initiator (EFI) is studied to realize the integration and large-scale manufacture of EFI. The integrated bridge foils are fabricated by magnetron sputtering and lithography technology. The PMMA photoresist flyer layer is fabricated on the bridge foil by UV thick photoresist lithography process. SU-8 photoresist is used to fabricate the acceleration chamber. 268 EFI chips are prepared on a wafer substrate with 0.018 cm³ for each chip. 50% ignition sensitivity of the integrated EFI is 2 185 V. The high temperature resistance of EFI chip is tested at 160 ℃ for 50 h. The results show that the EFI chips could reliably detonate HNS-Ⅳ. Key

Key words: ordnancescienceandtechnology, explodingfoilinitiator, non-siliconMEMS, magnetronsputtering

CLC Number:

TJ450.2

LI Ke-wei， CHU En-yi， XUE Yan， XIE Rui-zhen， REN Xiao-ming， REN Xi， LIU Lan， LIU Wei. Research on Exploding Foil Initiator Based on Non-silicon MEMS Technology[J]. Acta Armamentarii, 2017, 38(2): 261-266.

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第38卷第2期2017 年2月兵工学报ACTA
ARMAMENTARIIVol.38No.2Feb.2017

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