基于“回”型阴极屏蔽板的平面电铸件厚度分布均匀性研究

doi:10.3969/j.issn.1000-1093.2016.06.015

摘要/Abstract

摘要： 为进一步提高大面积平面电铸件厚度分布的均匀性，提出一种改进型电铸工艺——阴极加设“回”字型屏蔽板并做周向等幅平面运动，并对此进行了数值分析与实验研究。研究结果表明：“回”字型屏蔽板结构参数与位置参数对阴极电流密度分布有很大影响，采用改进型电铸工艺能显著改善电铸层厚度的分布特性，基于新工艺制备约为100 μm厚的电铸层（大小70 mm×70 mm）的厚度差小于8%.

关键词: 机械制造工艺与设备, 电铸, 厚度分布均匀性, 阴极屏蔽板, 阴极周向平动

Abstract: A modified electroforming approach is proposed to further improve the thickness uniformity of electroformed pieces with large areas. The proposed approach involves the addition of a hollow square cathode-shielding plate to the cathode which translates circumferentially. Some simulations and experiments were carried out to study the proposed method. The research results show that both geometrical feature parameters and placement positions of hollow square cathode-shielding plate have great effects on the cathode current density distribution. The thickness distribution of deposited metal can be significantly improved using the modified process in which thickness deviation of less than 8% is achieved for 100 μm thick deposit (70 mm×70 mm). The proposed electroforming approach is expected to provide an upgraded alternative for preparing the considerably uniform large-area flat electroformed layers.

Key words: manufacturing technology and equipment, electroforming, thickness distribution uniformity, cathode shielding plate, cathode circumferential translation

中图分类号:

TQ153.4

李慧娟，明平美，周涛，赵云龙，秦歌. 基于“回”型阴极屏蔽板的平面电铸件厚度分布均匀性研究[J]. 兵工学报, 2016, 37(6): 1075-1081.

LI Hui-juan, MING Ping-mei, ZHOU Tao, ZHAO Yun-long, QIN Ge. Research on Distribution Uniformity of Electroformed Metal Layer by Using Hollow Square Cathode-shielding Plate[J]. Acta Armamentarii, 2016, 37(6): 1075-1081.

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