基于格林函数的半导体桥三维非稳态传热模型

doi:10.3969/j.issn.1000-1093.2020.12.010

摘要/Abstract

摘要： 为提高半导体桥（SCB）与数字电路的集成度，将SCB焊接在印刷电路板（PCB）上。对于该种封装的特殊边界条件，半球传热模型不再适用，需要建立一个可以准确描述其传热过程的模型。格林函数引入建模过程，使用长方体而非球体模型，边界条件更接近真实情况，建立一种SCB三维非稳态传热模型。对SCB器件通以恒流后进行红外测温实验，同时使用传热模型计算温度，对比模型计算值与实验数据，最高温度误差不超过4 ℃，温度分布及温升趋势也较为吻合。结果表明，该模型较准确地表现了PCB封装SCB器件的非稳态传热过程。

关键词: 半导体桥, 传热模型, 非稳态传热, 格林函数

Abstract: To improve the integration of a semiconductor bridge (SCB) with digital circuit, the semiconductor bridge is welded on a printed circuit board (PCB). As the hemispherical heat-transfer model is no longer suitable for the special boundary conditions of this kind of package, a model which can accurately describe its heat-transfer process needs to be established. Green's function is applied to the modeling process, and a cuboid model instead of a sphere one is used so that the boundary conditions are closer to the real situation. Then a 3D unsteady heat-transfer model of semiconductor bridge is established. An infrared temperature measuring experiment is carried out after the semiconductor bridge device is connected with a constant current source, and the heat-transfer model is used to calculate the temperature. Comparison between the calculated value and the experimental data shows that the maximum temperature error is less than 4 ℃, and the distribution and rising trend of the temperature are also consistent. This result shows that the model can accurately represent the unsteady heat-transfer process of semiconductor bridge device packaged by a PCB.

Key words: semiconductorbridge, heat-transfermodel, unsteadyheattransfer, Green'sfunction

中图分类号:

TJ450.3⁺2

孙远，张良，邓有杞，李宋，张淇媛，张威. 基于格林函数的半导体桥三维非稳态传热模型[J]. 兵工学报, 2020, 41(12): 2451-2457.

SUN Yuan， ZHANG Liang， DENG Youqi， LI Song， ZHANG Qiyuan， ZHANG Wei. A Green's Function-based 3D Unsteady Heat-transfer Model for SCB[J]. Acta Armamentarii, 2020, 41(12): 2451-2457.

参考文献

［1］叶迎华. 火工品技术［M］. 北京：国防工业出版社, 2014.
YE Y H. Pyrotechnics technology［M］. Beijing:National Defense Industry Press, 2014.（in Chinese）
［2］ KIM J U, PARK C O, PARK M I, et al. Characteristics of semiconductor bridge (SCB) plasma generated in a micro-electro-mechanical system (MEMS)［J］. Physics Letters A, 2002, 305(6): 413-418.
［3］强涛, 周彬, 秦志春,等. 桥丝式电火工品安全电流的预测［J］. 南京理工大学学报, 2006, 30(1):110-112.
QIANG T, ZHOU B, QIN Z C, et al. Prediction of no-firing current of bridgewire electric explosive device［J］. Journal of Nanjing University of Science and Technology, 2006,30(1):110-112.(in Chinese)
［4］杨贵丽, 焦清介, 沈瑞琪. 恒流激励微型半导体桥发火临界性研究［J］. 火工品, 2011(3):1-5.
YANG G L, JIAO Q J, SHEN R Q. Study on critical firing current of micro-scale semiconductor bridge［J］. Initiators & Pyrotechnics, 2011(3):1-5.(in Chinese)
［5］ LEE K N, PARK M I, CHOI S H, et al. Characteristics of plasma generated by polysilicon semiconductor bridge (SCB)［J］. Sensors and Actuators A: Physical, 2002, 96(2/3):252-257.
［6］ COLE K D, BECK J V, LITKOUHI B, et al. Heat conduction using Green's functions［M］. 2nd ed. Boca Raton,FL,US: CRC Press Taylor & Francis Group, 2011:70-74.
［7］ NELSON R D. Wiring statistics and printed wiring board thermal conductivity［C］∥Proceedings of the 17th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. San Jose, CA, US: IEEE, 2001:252-260.
［8］马洪庭, 张泽宇, 李聪, 等.单颗粒印刷线路板热解传,热特性模拟研究［J］. 华中科技大学学报(自然科学版) , 2018,46(3): 116-121.
MA H T, ZHANG Z Y, LI C, et al. Simulation study on heat transfer characteristics of single printed circuit board particle in pyrolysis process［J］. Journal of Huazhong University of Science and Technology (Nature Science Edition), 2018,46(3): 116-121.(in Chinese)
［9］ GCZY A. Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering［J］. International Journal of Heat and Mass Transfer, 2017, 109:167-174.
［10］ CULHAM J R, YOVANOVICH M M. Factors affecting the calculation of effective conductivity in printed circuit boards ［thermal analysis］［C］∥Proceedings of the 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Seattle, WA, US: IEEE, 1998:460-467.
［11］晏敏, 颜永红, 曾云, 等. 非接触式红外测温原理及误差分析［J］. 计量技术, 2005(1):23-25.
YAN M, YAN Y H, ZENG Y, et al. Non-contact infrared temperature measurement principle and error analysis［J］. Measurement Technique, 2005(1):23-25.(in Chinese)

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