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兵工学报 ›› 2013, Vol. 34 ›› Issue (5): 620-626.doi: 10.3969/j.issn.1000-1093.2013.05.017

• 研究论文 • 上一篇    下一篇

可再制造的电镀金刚石砂轮结构设计

于爱兵, 吴磊   

  1. 宁波大学机械工程与力学学院, 浙江宁波315211
  • 上线日期:2013-07-22
  • 作者简介:于爱兵(1968—), 男, 教授,硕士生导师。
  • 基金资助:

    国家自然科学基金项目(51175270); 浙江省新苗人才项目(2011R405053)

Structure Design of Electroplated Diamond Wheel with Remanufacturing Characteristics

YU Ai-bing, WU Lei   

  1. Faculty of Mechanical Engineering and Mechanics, Ningbo University, Ningbo 315211, Zhejiang, China
  • Online:2013-07-22

摘要:

为了实现金刚石砂轮的绿色回收和再制造,设计了一种可拆卸式电镀金刚石砂轮结构。应用磨料层与基体的界面模型,分析了砂轮拆卸过程中磨料层的破坏形式。分析了砂轮拆卸过程中的磨料层应力状态,并计算出磨料层的开裂点位置。制备了新型可拆卸的电镀金刚石砂轮,并进行了磨料层与基体的分离试验。研究结果表明,在砂轮的拆卸过程中,滑道附近的磨料层与基体产生了界面破坏或曲折破坏,并使磨料层发生断裂。装配半圆形滑块的砂轮外圆具有较好的表面平整性,采用对称式凹形滑块结构可以提高砂轮的重复利用次数。所设计的电镀金刚石砂轮能够实现基体和磨料层的绿色分离和金刚石砂轮的再制造。

关键词: 刀具技术, 再制造, 金刚石, 砂轮, 回收

Abstract:

An electroplated diamond wheel with detachable structure is designed to realize the green recy- cling and remanufacturing of diamond grinding wheels. The failure modes of abrasive layer are analyzed using the interface model of abrasive layer and wheel substrate. The stress states of abrasive layer are an- alyzed in the disassembling process of wheel, and the position of cracking point on the abrasive layer is determined. The electroplated diamond wheels with detachable structure were fabricated, and the separa- ting experiments of abrasive layer and substrate were carried out. The research results show that the inter- face crack or kinking crack occurs between abrasive layer and substrate nearby the slide during disassem- bling, resulting in the fracture of abrasive layer. The wheel cylindrical surface assembled with semicircu- lar slide blocks shows better smoothness. The symmetrical concave structure of slide block can improve the utilization rate of wheel. The green separation of abrasive layer from substrate and the remanufacturing of diamond grinding wheels can be realized for the electroplated diamond wheel.

Key words: cutting tool technology, remanufacturing, diamond, wheel, recyclin

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