Thermal Environment Adaptability of MIN Board for Special Equipment Simulator Computer

doi:10.3969/j.issn.1000-1093.2021.06.022

Abstract

Abstract: The thermal environment adaptability assessment of most military electronic equipment only refers to the data from high and low temperature alternating experiments carried out according to American military standard，and the fixed high and low temperature standards make the experimental temperature often deviate from reality，which can only qualitatively analyze its thermal environment adaptability and is difficult to be used as a reference basis for task decision-making and maintenance testing.In order to truly reproduce the state of the military electronic equipment in the thermal environment，SolidWorks mechanical design automation software is used to create a CAD model of MD type simulator computer switch input board (referred to as MIN board)，and convert its task state spectrum into an environmental temperature spectrum and electronic component thermal power consumption spectrum，which are the input parameters of Icepak simulation. In addition，with the help of Arrhenius model and the improved C-M equation，the actual failure data of key electronic components obtained from the optimal accelerated degradation tests and the temperature data of electronic components and circuit boards obtained from the simulation are used as the parameters to calculate the thermal degradation failure times of electronic components and the thermal fatigue life of solder joints. At the same time， the competitive failure mode is used to evaluate the predicted life and weak links of MIN board，and the lifetime data is used as a quantitative characterization of its thermal environment adaptability. The simulated results show that the thermal degradation of electronic components is the main influencing factor for the thermal failure of MIN board，and the thermal fatigue of solder joints is the secondary influencing factor. Its weak points are mainly programmable logic devices and three-state buffers，and the predicted lifetimes in the north，east and south regions are 10-11，8-9 and 5-6 years，espectively，which roughly coincides with the actual failure time.

Key words: simulator, MINboard, thermalenvironmentadaptability, thermaldegradation, Arrheniusmodel, thermalfatigue, improvedC-Mequation

CLC Number:

TJ768.3

LI Yongqiang, L Weimin. Thermal Environment Adaptability of MIN Board for Special Equipment Simulator Computer[J]. Acta Armamentarii, 2021, 42(6): 1312-1323.

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