Preparation of Ni-coated W Powder by Electroless Plating

doi:10.3969/j.issn.1000-1093.2014.09.022

Abstract

Abstract: The effects of W powder particle size, complexing agent, W powder loading on the electroless Ni plating on the surface of W powder are analyzed, and the morphology of coated particle, utilization rate of Ni and deposition rate are investigated. The controllable electroless Ni plating process parameters are optimized. The Ni-coated W powders are mixed with Cu powders, and then the mixed powders are sintered to prepare 67W-25Cu-8Ni alloy by using spark plasma sintering (SPS) technique. 67W-25Cu-8Ni alloy is analyzed by scanning electric microscope (SEM), energy dispersive spectrometer (EDS) and X-ray diffraction (XRD). Results show that, when W powder particle size is in range from 4 μm to 6 μm, the complexing agent of sodium pyrophosphate is 60 g/L, triethanolamine is 100 g/L, and trisodium citrate is 8 g/L. The Ni layer is uniform and complete, and the weight percent of Ni in W-Ni powder can be controlled by adjusting the W powder loading. Metallurgical bonding is achieved at the W/Ni/Cu interface. Compared with W-Cu alloy, the sintering density of 67W-25Cu-8Ni alloy prepared by SPS is greatly increased, reaching to 97%.

Key words: suface and interface of material, W-Cu alloy, electroless plating, tungsten powder

CLC Number:

TQ150.1

ZHANG Hong-yan， WANG Ying-chun， LIU Jin-xu， ZHAO Zi-ying， GUO Wen-qi， LI Shu-kui. Preparation of Ni-coated W Powder by Electroless Plating[J]. Acta Armamentarii, 2014, 35(9): 1481-1487.

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