Abstract: Electrophoretic deposition is a film forming technology that is highly compatible with different electrode shapes, highly controllable, and low-cost. Yet, its adhesion and hardness are relatively low, which limits its use in energetic materials. To improve the adhesion of electrodeposited energetic films, a convenient post-processing strategy is proposed. The target films are impregnated with different concentrations (0.1 mol/L, 0.2 mol/L, 0.5 mol/L) of an inert inorganic salt solution (KCl solution). The morphology, composition, heat release, and adhesion of the Al/CuO films are examined by scanning electron microscopy, X-ray diffraction, simultaneous thermal analyzer, high-speed camera, and American national by tape standard ATSM D 3359—17 standard test methods for rating adhesion by tape tests. The results show that the treated Al/CuO energetic film surface is loaded with KCl, and that the inorganic salt solution is recrystallized during the drying process, thus filling the gaps between the energetic particles and forming a network structure, bonding the scattered particles and boosting the film adhesion from Level 1 to Level 3. Furthermore, the heat released by Al/KCl (0.2 mol/L)/CuO film after treatment is 1 781 J/g, 164 J/g higher than that of the Al/CuO film (1 617 J/g) before treatment. Due to the filling of KCI inorganic salt, the heat release of the Al/KCl/CuO system is improved, increasing the contact between nanoparticles and enhancing the density of the energetic film.

Key words: energeticfilm, electrophoreticdeposition, filmadhesion, inorganicsalt, thermitefilm