特种装备模拟器计算机MIN板热环境适应性

doi:10.3969/j.issn.1000-1093.2021.06.022

摘要/Abstract

摘要： 多数军用电子设备的热环境适应性评定仅参考依据美军军用标准进行的高低温交变试验数据，而固定的高低温标准使得试验温度往往脱离实际，仅能定性分析其热环境适应能力的强弱，难以作为任务决策及维护检测的参考依据。为真实再现军用电子设备所处的热环境状态，借助机械设计自动化软件Solidworks创建MD型模拟器计算机开关量输入板（简称MIN板）计算机辅助设计模型，并将其任务状态谱转变为环境温度谱和电子元器件热功耗谱，作为Icepak仿真的输入参数。以Arrhenius模型和改进C-M方程为基础，结合最优加速退化试验所得关键电子元器件实际失效数据及仿真所得电子元器件和电路板温度数据，分别解算电子元器件热退化失效时间及焊点热疲劳寿命。采用竞争失效方式评估MIN板预测寿命及薄弱环节，并将寿命数据作为其热环境适应性的定量化表征。仿真结果表明，电子元器件热退化为MIN板热失效的主要影响因素，焊点热疲劳为次要影响因素，其薄弱点主要为可编程逻辑器件及三态缓冲器，且北部、东部和南部地区预测寿命分别为10~11 a、8~9 a和5~6 a，与实际使用故障时间大致吻合。

关键词: 模拟器, MIN板, 热环境适应性, 热退化, Arrhenius模型, 热疲劳, 改进C-M方程

Abstract: The thermal environment adaptability assessment of most military electronic equipment only refers to the data from high and low temperature alternating experiments carried out according to American military standard，and the fixed high and low temperature standards make the experimental temperature often deviate from reality，which can only qualitatively analyze its thermal environment adaptability and is difficult to be used as a reference basis for task decision-making and maintenance testing.In order to truly reproduce the state of the military electronic equipment in the thermal environment，SolidWorks mechanical design automation software is used to create a CAD model of MD type simulator computer switch input board (referred to as MIN board)，and convert its task state spectrum into an environmental temperature spectrum and electronic component thermal power consumption spectrum，which are the input parameters of Icepak simulation. In addition，with the help of Arrhenius model and the improved C-M equation，the actual failure data of key electronic components obtained from the optimal accelerated degradation tests and the temperature data of electronic components and circuit boards obtained from the simulation are used as the parameters to calculate the thermal degradation failure times of electronic components and the thermal fatigue life of solder joints. At the same time， the competitive failure mode is used to evaluate the predicted life and weak links of MIN board，and the lifetime data is used as a quantitative characterization of its thermal environment adaptability. The simulated results show that the thermal degradation of electronic components is the main influencing factor for the thermal failure of MIN board，and the thermal fatigue of solder joints is the secondary influencing factor. Its weak points are mainly programmable logic devices and three-state buffers，and the predicted lifetimes in the north，east and south regions are 10-11，8-9 and 5-6 years，espectively，which roughly coincides with the actual failure time.

Key words: simulator, MINboard, thermalenvironmentadaptability, thermaldegradation, Arrheniusmodel, thermalfatigue, improvedC-Mequation

中图分类号:

TJ768.3

李永强, 吕卫民. 特种装备模拟器计算机MIN板热环境适应性[J]. 兵工学报, 2021, 42(6): 1312-1323.

LI Yongqiang, L Weimin. Thermal Environment Adaptability of MIN Board for Special Equipment Simulator Computer[J]. Acta Armamentarii, 2021, 42(6): 1312-1323.

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