特种装备模拟器计算机MIN板热环境适应性

doi:10.3969/j.issn.1000-1093.2021.06.022

摘要/Abstract

摘要： 多数军用电子设备的热环境适应性评定仅参考依据美军军用标准进行的高低温交变试验数据，而固定的高低温标准使得试验温度往往脱离实际，仅能定性分析其热环境适应能力的强弱，难以作为任务决策及维护检测的参考依据。为真实再现军用电子设备所处的热环境状态，借助机械设计自动化软件Solidworks创建MD型模拟器计算机开关量输入板（简称MIN板）计算机辅助设计模型，并将其任务状态谱转变为环境温度谱和电子元器件热功耗谱，作为Icepak仿真的输入参数。以Arrhenius模型和改进C-M方程为基础，结合最优加速退化试验所得关键电子元器件实际失效数据及仿真所得电子元器件和电路板温度数据，分别解算电子元器件热退化失效时间及焊点热疲劳寿命。采用竞争失效方式评估MIN板预测寿命及薄弱环节，并将寿命数据作为其热环境适应性的定量化表征。仿真结果表明，电子元器件热退化为MIN板热失效的主要影响因素，焊点热疲劳为次要影响因素，其薄弱点主要为可编程逻辑器件及三态缓冲器，且北部、东部和南部地区预测寿命分别为10~11 a、8~9 a和5~6 a，与实际使用故障时间大致吻合。

关键词: 模拟器, MIN板, 热环境适应性, 热退化, Arrhenius模型, 热疲劳, 改进C-M方程

Abstract: The thermal environment adaptability assessment of most military electronic equipment only refers to the data from high and low temperature alternating experiments carried out according to American military standard，and the fixed high and low temperature standards make the experimental temperature often deviate from reality，which can only qualitatively analyze its thermal environment adaptability and is difficult to be used as a reference basis for task decision-making and maintenance testing.In order to truly reproduce the state of the military electronic equipment in the thermal environment，SolidWorks mechanical design automation software is used to create a CAD model of MD type simulator computer switch input board (referred to as MIN board)，and convert its task state spectrum into an environmental temperature spectrum and electronic component thermal power consumption spectrum，which are the input parameters of Icepak simulation. In addition，with the help of Arrhenius model and the improved C-M equation，the actual failure data of key electronic components obtained from the optimal accelerated degradation tests and the temperature data of electronic components and circuit boards obtained from the simulation are used as the parameters to calculate the thermal degradation failure times of electronic components and the thermal fatigue life of solder joints. At the same time， the competitive failure mode is used to evaluate the predicted life and weak links of MIN board，and the lifetime data is used as a quantitative characterization of its thermal environment adaptability. The simulated results show that the thermal degradation of electronic components is the main influencing factor for the thermal failure of MIN board，and the thermal fatigue of solder joints is the secondary influencing factor. Its weak points are mainly programmable logic devices and three-state buffers，and the predicted lifetimes in the north，east and south regions are 10-11，8-9 and 5-6 years，espectively，which roughly coincides with the actual failure time.

Key words: simulator, MINboard, thermalenvironmentadaptability, thermaldegradation, Arrheniusmodel, thermalfatigue, improvedC-Mequation

中图分类号:

TJ768.3

李永强, 吕卫民. 特种装备模拟器计算机MIN板热环境适应性[J]. 兵工学报, 2021, 42(6): 1312-1323.

LI Yongqiang, L Weimin. Thermal Environment Adaptability of MIN Board for Special Equipment Simulator Computer[J]. Acta Armamentarii, 2021, 42(6): 1312-1323.

参考文献

［1］ PETZOLD J.Social adaptability in ecotones: sea-level rise and climate change adaptation in flushing and the Isles of Scilly，UK[J].Island Studies Journal，2018，13(1):101-118.
[2］ SILVA C A G D，SANTOS E L D.Reliability of components in power amplifiers based in MIL-HDBK-217F standard[C]∥Proceedings of the 33rd South Symposium on Microelectronics.Curitiba，Brazil：IEEE，2018:85-88.
[3］李飞，汝枫，赵军贵，等.导弹武器全天候自然环境实验室研究[J].导弹与航天运载技术，2016(3):40-43.
LI F，RU F，ZHAO J G，et al.Research of missile weapon's full-weather natural environment laboratory[J].Missiles and Space Vehicles，2016(3):40-43.(in Chinese)
[4］ VASILEV E N，DEREVYANKO V A，KORKHOVA M I. Experimental study of the dynamics of phase changes in a heat storage of thermal control system of electronic equipment[J].Thermophysics and Aeromechanics，2019，26(6):917-924.
[5］ KOIZUMI K，HATAKEYAMA T，UKUE T，et al.Thermal modeling of electronic components for thermal simulation of electronic equipment[C]∥Proceedings of the International Conference on Electronics Packaging.Toyama，Japan：IEEE，2014:581-584.
[6］ NAKAYAMA W，MATSUKI R，HACHO Y，et al.A new role of CFD simulation in thermal design of compact electronic equipment: application of the build-up approach to thermal analysis of a benchmark model[J].Journal of Electronic Packaging，2004，126(4): 440-445.
[7］ BROECK C H V D，RUPPERT L A，HINZ A，et al.Spatial electro-thermal modeling and simulation of power electronic modules[J].IEEE Transactions on Industry Applications，2018，54(1):404-415.
[8］赵昕红，戴翔.装备仿真测试技术研究[J].测控技术，2020，39(3): 71-75.
ZHAO X H，DAI X.Research on equipment simulation test technology[J].Measurement & Control Technology，2020，39(3):71- 75.(in Chinese)
[9］曹胜.基于故障物理的电子产品可靠性预计与试验研究[D].成都：电子科技大学，2016.
CAO S.Research on reliability prediction and test method based on physics of failure of electronic products[D].Chengdu：University of Electronic Science and Technology of China，2016.(in Chinese)
[10］张志峰.导弹模拟器通用开发平台研制[D].哈尔滨：哈尔滨工业大学，2013.
ZHANG Z F.Development of universal missile simulator[D].Harbin：Harbin Institute of Technology，2013. (in Chinese)
[11］杨小芳，张云超，刘刚.某电子设备水下湿端总体结构设计与热仿真[J].机械研究与应用，2019，32(3):89-91，97.
YANG X F，ZHANG Y C，LIU G.Overall structure design and thermal simulation of underwater terminal of electronic equipment[J].Mechanical Research & Application，2019，32(3):89-91，97.(in Chinese)
[12］ LI J，TIAN Y，WANG D.Change-point detection of failure mechanism for electronic devices based on Arrhenius model[J].Applied Mathematical Modelling，2020，83(1):46-58.
[13］钱环宇，余永刚，刘静.火炮射击环境温度对膛内模块装药热安全性的影响分析[J].兵工学报，2020，41(2):254-261.
QIAN H Y，YU Y G，LIU J.The influence of ambient temperature after gun firing on thermal safety of modular charge in the chamber[J]. Acta Armamentarii，2020，41(2):254-261.(in Chinese)
[14］ PANG D，ZHANG A，WANG B L，et al.Theoretical analysis of the thermoelectric generator considering surface to surrounding heat convection and contact resistance[J].Journal of Electronic Materials，2019，48(1):596-602.
[15］ ALKASASSBEH M，OMAR Z，MEBAREK-OUDINA F，et al.Heat transfer study of convective fin with temperature-dependent internal heat generation by hybrid block method[J]. Heat Transfer-Asian Research，2019，48(4):1225-1244.
[16］王晓晗，罗宏伟. 电子元器件检验技术（试验部分）[M].北京: 电子工业出版社, 2019: 48-57.
WANG X H，LUO H W. Electronic component inspection technology (test part)[M]. Beijing: Publishing House of Electronics Industry, 2019: 48-57. (in Chinese)
[17］ ZHAO S，MAKIS V，CHEN S，et al. Health assessment method for electronic components subject to condition monitoring and hard failure[J].IEEE Transactions on Instrumentation and Measurement，2019，68(1):138-150.
[18］盖炳良，滕克难，王浩伟，等.基于随机相关的电子部件二元加速退化可靠性评估[J].北京航空航天大学学报，2019，45(11): 2237-2246.
GE B L，TENG K N，WANG H W，et al.Reliability assessment for electronic components with bivariate accelerated degradation based on random correlation[J].Journal of Beijing University of Aeronautics and Astronautics，2019，45(11): 2237-2246. (in Chinese)
[19］吕卫民，李永强.电子功能部件环境适应性试验优化设计[J].系统工程与电子技术，2020，42(7):1630-1636.
L W M，LI Y Q.Electronic functional equipment environment adaptability test optimal design[J].System Engineering and Electronics，2020，42(7):1630-1636.(in Chinese)
[20］ IRUELA M，RUBIO J，CUBERO J I，et al.A damage integral approach to thermal fatigue of solder joints[J].Microelectronics Reliability，2002，30(6):643-651.
[21］ BHANGU N S，PAHUJA G L，SINGH R.Enhancing reliability of thermal power plant by implementing RCM policy and developing reliability prediction model: a case study[J].International Journal of System Assurance Engineering & Management，2017，8(S2): 1923-1936.
[22］ BORGESEN P，WENTLENT L，HAMASHA S，et al.A mechanistic thermal fatigue model for Sn-Ag-Cu solder joints[J].Journal of Electronic Materials，2018，47(10):2526-2544.
[23］ PAN H，MA L，ZHU L，et al.Thermal design of electronic equipment based on parametric simulation[C]∥Proceedings of the 7th Asia International Symposium on Mechatronics.Beijing，China：IEEE，2020:319-325.

[1]	肖晶，吴刚，谢霖燊，王海洋，孙楚昱. 线栅参数对双锥-平面线栅水平极化辐射波模拟器的影响[J]. 兵工学报, 2021, 42(8): 1708-1715.
[2]	刘欢，王春艳，王志强，孙昊，赵义武. 色温星模拟器用抛物面离轴反射光学系统设计[J]. 兵工学报, 2021, 42(3): 572-580.
[3]	肖晶，吴刚，王海洋，谢霖燊，程乐，郭景海. 电磁脉冲辐射波模拟器双锥-平面线栅天线场分布规律[J]. 兵工学报, 2021, 42(12): 2684-2692.
[4]	邓青, 薛青, 高恒, 翟凯. 基于双向概念格的坦克驾驶模拟训练关联规则挖掘[J]. 兵工学报, 2020, 41(12): 2397-2407.
[5]	邓青，薛青，罗佳. 基于支持向量机的坦克驾驶模拟训练结果分析[J]. 兵工学报, 2019, 40(9): 1953-1960.
[6]	潘卫东，范元勋，雷建杰，曹大伟，陆鹏程，徐志伟. 摩擦对电动直线负载模拟器的影响及其抑制研究[J]. 兵工学报, 2019, 40(10): 2050-2059.
[7]	骆燕燕, 刘旭阳，郝杰，王振, 刘磊，林小明. 航空电连接器热疲劳失效机理研究[J]. 兵工学报, 2016, 37(7): 1266-1274.
[8]	丁勇，肖泽龙，许建中，彭树生. 毫米波交流辐射计半实物仿真系统设计[J]. 兵工学报, 2015, 36(10): 1867-1874.
[9]	乔杨, 徐熙平, 辜义文, 潘越, 张潇予. 消热差的红外目标模拟器投影光学系统设计[J]. 兵工学报, 2013, 34(4): 431-436.
[10]	王力，钱林方，高强，郭旗. 基于灰预测模糊PID的随动系统负载模拟器力矩控制研究[J]. 兵工学报, 2012, 33(11): 1379-1386.
[11]	李长春，延皓，张金英，刘晓东. 一种改进的6自由度运动模拟器逆动力学模型[J]. 兵工学报, 2009, 30(4): 446-450.
[12]	闰明，孙志礼，杨强，陈凤熹，刘勤. 蠕变-热疲劳裂纹的控制参量研究[J]. 兵工学报, 2008, 29(4): 425-429.
[13]	张琦，孙劭文，李文鸿，孙伟. 履带式多用工程车训练模拟器的设计与实现[J]. 兵工学报, 2007, 28(5): 621-624.
[14]	陆锦辉. 弹载脉冲多普勒雷达目标模拟器宽带频率跟踪方法设计[J]. 兵工学报, 2005, 26(3): 330-334.
[15]	1:张小凤,赵俊渭,王尚斌;2:杜栓平,胡青. 水下物理目标声反射器研究[J]. 兵工学报, 2004, 25(5): 600-603.