抗火光干扰红外成像探测技术发展现状综述

doi:10.12382/bgxb.2024.0868

摘要/Abstract

摘要：

在使用红外成像探测物体高温燃烧产生的火焰、物体爆炸产生的高温碎片场景时,由于红外成像视场内场景温度快速升高,导致红外成像动态范围变大、图像饱和、细节信息丢失、弱小目标被高温背景淹没等现象,针对上述问题总结出抗火光干扰高动态红外成像探测技术途径,系统介绍抗火光干扰高动态红外成像相关技术研究现状,围绕技术发展途径,分析给出抗火光干扰高动态红外成像探测技术的发展趋势。

关键词: 红外成像, 高动态, 图像饱和, 高温碎片场景, 抗火光干扰

Abstract:

When using infrared imaging to detect the scenes of flames generated by high-temperature combustion of objects and high-temperature fragments generated by object explosions,the rapid increase in scene temperature within the infrared imaging field of view leads to an increase in the dynamic range of infrared imaging,the image saturation,the loss of detail information,and the submergence of weak targets by high-temperature backgrounds.Therefore,it is urgent to develop an anti-fire interference high dynamic infrared imaging detection technology.This article briefly introduces the current development status of high dynamic infrared imaging technology with anti-fire interference capability.On this basis,the development trend of high dynamic infrared imaging detection technology with anti-fire interference capability is analyzed.

Key words: infrared imaging, high dynamic, Image saturation, high-temperature fragment, anti-fire interference

吕晓英, 唐嘉钰, 吴世林, 曹渊, 刘琳. 抗火光干扰红外成像探测技术发展现状综述[J]. 兵工学报, 2024, 45(S2): 90-96.

LÜ Xiaoying, TANG Jiayu, WU Shilin, CAO Yuan, LIU Lin. Research on the Demand Analysis and Development Status of Anti-fire Interference High Dynamic Infrared Imaging Technology[J]. Acta Armamentarii, 2024, 45(S2): 90-96.

图/表 8

表1 数字读出探测器典型产品

Table 1 Performance parameters of typical digital readout detectors

数字读出探测器典型产品	探测器材料	面阵规模	像元间距/μm	响应波长/μm	NETD/mK	ADC精度/bit	最高帧频/Hz
以色列SCD PelicanD	锑化铟	640×512	15	2.0~4.0	20	13~15	240
美国洛克希德-马丁SBF191	锑化铟	640×512	20	2.0~4.0	13	13~14	120
法国Sofradir	锑化铟	1024×768	10	3.7~4.8	25	14	120

图1 用于战术无人机的传感器成像

Fig.1 Sensor imaging for tactical drones

图2 “黑杰克”小型战术无人机及短波红外传感器

Fig.2 Black Jack small tactical drone and shortwave infrared sensor

图3 FLIR公司最新开发的InGaAs焦平面光电系统

Fig.3 FLIR’s latest developed InGaAs focal plane array optoelectronic system

图4 融合成像效果

Fig.4 Fusion imaging rendering

图5 富士公司多灵敏度传感器

Fig.5 Multi-sensitivity sensor of Fuji company

图6 FLIR超帧成像技术

Fig.6 Hyperframe imaging technology of FLIR Company

图7 实时高分辨散射成像

Fig.7 Real-time high-resolution scattering imaging

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