A Green's Function-based 3D Unsteady Heat-transfer Model for SCB

doi:10.3969/j.issn.1000-1093.2020.12.010

Abstract

Abstract: To improve the integration of a semiconductor bridge (SCB) with digital circuit, the semiconductor bridge is welded on a printed circuit board (PCB). As the hemispherical heat-transfer model is no longer suitable for the special boundary conditions of this kind of package, a model which can accurately describe its heat-transfer process needs to be established. Green's function is applied to the modeling process, and a cuboid model instead of a sphere one is used so that the boundary conditions are closer to the real situation. Then a 3D unsteady heat-transfer model of semiconductor bridge is established. An infrared temperature measuring experiment is carried out after the semiconductor bridge device is connected with a constant current source, and the heat-transfer model is used to calculate the temperature. Comparison between the calculated value and the experimental data shows that the maximum temperature error is less than 4 ℃, and the distribution and rising trend of the temperature are also consistent. This result shows that the model can accurately represent the unsteady heat-transfer process of semiconductor bridge device packaged by a PCB.

Key words: semiconductorbridge, heat-transfermodel, unsteadyheattransfer, Green'sfunction

CLC Number:

TJ450.3⁺2

SUN Yuan， ZHANG Liang， DENG Youqi， LI Song， ZHANG Qiyuan， ZHANG Wei. A Green's Function-based 3D Unsteady Heat-transfer Model for SCB[J]. Acta Armamentarii, 2020, 41(12): 2451-2457.

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