电子器件抗冲击异质聚氨酯灌封防护：实验与模拟研究

沈天阳; 蒋招绣; 王永刚

doi:10.12382/bgxb.2025.1081

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电子器件抗冲击异质聚氨酯灌封防护：实验与模拟研究

更新时间：2026-04-09

- 电子器件抗冲击异质聚氨酯灌封防护：实验与模拟研究
- Impact-Resistant Heterogeneous Polyurethane Potting Protection for Electronic Devices: Experimental and Simulation Study
- 兵工学报 2026年
- 作者机构：
  
  宁波大学冲击与安全工程教育部重点实验室,浙江,宁波,315211
- 作者简介：
- 基金信息：
  
  国家自然科学基金项目(U2530210、12102213)
- DOI：10.12382/bgxb.2025.1081
  中图分类号： TN305.94
- 收稿：2025-12-09，
  
  网络首发：2026-04-09，
- 稿件说明：
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沈天阳，蒋招绣，王永刚. 电子器件抗冲击异质聚氨酯灌封防护：实验与模拟研究[J/OL]. 兵工学报, 2026(2026-04-09). https://doi.org/10.12382/bgxb.2025.1081.

SHEN T Y, JIANG Z X, WANG Y G. Impact-resistant heterogeneous polyurethane potting protection for electronic devices: experimental and simulation study[J/OL]. Acta Armamentarii, 2026(2026-04-09). https://doi.org/10.12382/bgxb.2025.1081. (in Chinese)
沈天阳，蒋招绣，王永刚. 电子器件抗冲击异质聚氨酯灌封防护：实验与模拟研究[J/OL]. 兵工学报, 2026(2026-04-09). https://doi.org/10.12382/bgxb.2025.1081. DOI：

SHEN T Y, JIANG Z X, WANG Y G. Impact-resistant heterogeneous polyurethane potting protection for electronic devices: experimental and simulation study[J/OL]. Acta Armamentarii, 2026(2026-04-09). https://doi.org/10.12382/bgxb.2025.1081. (in Chinese) DOI：

摘要

灌封防护技术对于解决电子器件在冲击载荷下的失效问题具有关键作用。聚氨酯因其优异的力学性能，被视为电子器件抗冲击防护中理想灌封材料。制备两种硬度异质聚氨酯灌封材料，设计4种组合形式(全软、全硬、硬-软-硬及软-硬-软)的灌封防护缓冲结构，并分别借助美国Instron公司生产的Instron 5966电子万能试验机和CEAST 9350落锤试验机，对两种聚氨酯灌封材料的力学性能及4种灌封防护结构的冲击特性进行实验研究。实验结果表明，不同应变率下两种聚氨酯均展示出典型的非线性黏弹性力学行为，相较于其他3种结构，软-硬-软复合灌封防护结构在减小撞击力的同时，能够有效限制电子器件的变形，展现出更优的综合防护性能。基于实验结果，采用Abaqus瞬态有限元分析软件，通过嵌入Z-W-T黏弹性本构模型来准确描述聚氨酯力学行为，开展聚氨酯灌封防护结构冲击响应数值模拟研究。模拟结果显示，相比其他3种防护结构，软-硬-软防护结构中的印刷电路板（Printed Circuit Board，PCB）板应力水平较低且分布更为均匀，同时芯片和PCB板之间的焊点界面应力整体较小，进一步验证了该结构在提升电子器件抗冲击能力方面的显著效果。

Abstract

Potting protection technology plays a critical role in mitigating the failure of electronic devices under impact loading. Polyurethane

owing to its excellent mechanical properties

is considered an ideal potting material for impact protection of electronic components. In this study

two hardness-heterogeneous polyurethane potting materials were prepared

and four types of composite protective structures (fully soft

fully hard

hard-soft-hard

and soft-hard-soft) were designed. The mechanical properties of the two polyurethane materials and the impact characteristics of the four protective structures were experimentally investigated using an Instron 5966 electronic universal testing machine and a CEAST 9350 drop hammer impact tester

both manufactured by Instron

USA. Experimental results show that both polyurethane materials exhibit typical nonlinear viscoelastic mechanical behavior under different strain rates. Compared with the other three structures

the soft-hard-soft composite potting structure not only reduces impact force but also effectively limits the deformation of electronic devices

demonstrating superior comprehensive protective performance. Based on the experimental results

numerical simulations of the impact response of polyurethane potting protective structures were conducted using Abaqus transient finite element analysis software

in which the Z-W-T viscoelastic constitutive model was embedded to accurately describe the mechanical behavior of polyurethane. The simulation results indicate that

compared with the other three protective structures

the soft-hard-soft structure leads to lower and more uniformly distributed stress levels in the printed circuit board (PCB)

as well as smaller overall interfacial stress at the solder joints between the chip and the PCB. These findings further validate the significant effectiveness of the soft-hard-soft structure in enhancing the impact resistance of electronic devices.

关键词

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