To address the challenges of high cost and lack of effective evaluation metrics in optimizing the Frequency Modulated Continuous Wave(FMCW) fuze microsystem integration process

this paper proposes an efficient design method integrating analytical modeling and intelligent optimization

verified via the industry-standard HFSS-ADS platform. Based on the Fan-out Wafer-level Package(FOWLP) process

a three-dimensional integrated structure for the FMCW fuze is constructed. An analytical approach using two-port network cascade operations is introduced to compute system circuit parameters

achieving an error of less than 0.2% compared with HFSS-ADS field-circuit co-simulation results. A novel metric

the "passive interconnection impact factor

" is proposed to quantify the global influence of the integrated interconnect structure on system signal-to-noise ratio(SNR). A cooperative optimization strategy combining optimization algorithms and surrogate models is developed. After evaluating nine algorithm combinations

the quasi-Newton method with Support Vector Machine(SVM) is identified as the optimal approach

completing a single optimization run in an average of 2.03 seconds. The optimized structure exhibits significant dimensional differences from empirically designed structures

reduces the passive interconnection impact factor by 10.26%

and improves SNR performance. This study provides a comprehensive methodology covering simulation modeling

efficient analysis

and intelligent optimization for fuze microsystem co-design.