李晓军 , 张惠贤 , 党爱国 , 等 . 俄军精确弹药作战使用及对防护工程建设的启示 [J ] . 防护工程 , 2022 , 44 ( 3 ): 64 - 69 .

LI X J , ZHANG H X , DANG A G , et al. Operational employment of Russian precision munitions and its revelation for protective engineering construction [J ] . Protective Engineering , 2022 , 44 ( 3 ): 64 - 69 . (in Chinese)

钱立志 , 蒋滨安 , 郭佳晖 . 信息化炮弹抗高过载设计方法 [J ] . 兵工学报 , 2023 , 44 ( 5 ): 1310 - 1320 .

QIAN L Z , JIANG B A , GUO J H , et al. Anti-high-overload design method of information projectile [J ] . Acta Armamentarii , 2023 , 44 ( 5 ): 1310 - 1320 . (in Chinese) DOI: 10.12382/bgxb.2022.0016 http://doi.org/10.12382/bgxb.2022.0016 With the development of operational requirements and information technology, all kinds of information projectiles with the functions such as reconnaissance and positioning, precision attack, blockade and jamming have been born. The exertion of their effectiveness usually requires that the missile borne functional devices/components, missile body structure and materials can resist various high overload effects. The anti-high overload technology has become one of the main bottleneck technologies restricting the rapid development of shell informatization and intelligence. This paper combs the development process of the anti-high overload problem of information projectiles, and expounds its essential connotation. The key anti-high overload technologies such as overload environment modeling and measurement, anti-overload structure and materials, anti-high overload test are summarized. This paper puts forward the anti-high overload design idea with functional protection as the core goal, defines the anti-high overload design process of information projectiles. The anti-high overload method of “body strength reinforcement, support deformation and energy absorption, structural member damage transfer and intersection of cutting-edge technologies” proposed in this paper has achieved good results in engineering practice, and provides some reference for the anti-high overload design of information projectiles, rockets and missiles with high overload characteristics.

崔梦曦 , 郝宏旭 , 王新星 , 等 . 基于导引头-弹体耦合模型和伴随制导系统的火箭弹脱靶量快速估计方法 [J ] . 兵工学报 , 2022 , 43 ( 10 ): 2554 - 2564 .

CUI M X , HAO H X , WANG X X , et al. Rapid estimation method for miss distance of rocket projectile based oncoupled seeker-projectile model and adjoint guidance system [J ] . Acta Armamentarii , 2022 , 43 ( 10 ): 2554 - 2564 . (in Chinese)

VERBERNE P , MEGUID S A , ELSAYED E A . Survivability of embedded microelectronics in precision guided projectiles:Modeling and characterization [J ] . International Journal of Impact Engineering , 2021 , 154 : 103864 .

王海霞 . 抗冲击弹载记录仪的设计与研究 [D ] . 太原 : 中北大学 , 2019 .

WANG H X . Design and research of impact-resistant missile recorder [D ] . Taiyuan : North University of China , 2019 . (in Chinese)

高超 . 弯振复合载荷下板级组件焊点应力应变分析与优化 [D ] . 桂林 : 桂林电子科技大学 , 2021 .

GAO C . Stress and strain analysis and optimization of solder joints of board-level components under combined bending and vibration loads [D ] . Guilin : Guilin University of Electronic Technology , 2021 . (in Chinese)

ISMAIL N , YUSOFF W Y W , AMAT A , et al. A review of extreme condition effects on solder joint reliability:understanding failure mechanisms [J ] . Defence Technology , 2024 , 41 : 134 - 158 .

ZHANG X H , LI J Z , QIN F , et al. Experiments and numerical simulations of microelectronic devices subjected to multipoint impact loading [J ] . Microelectronics Reliability , 2021 , 127 : 114408 .

李望云 , 李兴民 , 汪健 , 等 . 电-热-力耦合载荷下非均匀组织Cu/Sn-58Bi/Cu微焊点拉伸力学性能研究 [J ] . 机械工程学报 , 2022 , 58 ( 2 ): 307 - 320 . DOI: 10.3901/JME.2022.02.307 http://doi.org/10.3901/JME.2022.02.307 电子封装微焊点往往在电、热、力等多种载荷共同作用下服役，且具有鲜明的组织不均匀特征。研究电-热-力耦合载荷下电流密度和温度对电子封装组织不均匀线型Cu/Sn-58Bi/Cu微焊点拉伸力学性能及其尺寸效应的影响。结果表明，较低温度和较低电流密度情况下，随焊点高度降低，Cu基底对钎料的力学约束增强，焊点拉伸强度提高，断裂发生在钎料体内，呈韧性断裂，与室温无电流情况下的力学行为和断裂模式一致。钎料内Sn相与Bi相电流密度非均匀分布所致的局部电流拥挤现象使两相间的温度梯度明显增加，因此由热膨胀系数差异所致的相界面应变失配和界面应力增大，致使焊点强度低于室温无电流加载时的值。随着温度和电流密度升高，Sn相与Bi相界面及钎料与IMC层界面的应变失配和界面应力加剧，导致焊点拉伸强度进一步下降；同时，断裂位置从钎料基体内逐渐转移至钎料/IMC层界面处，断裂模式由韧性断裂转为韧-脆混合断裂。

LI W Y , LI X M , WANG J , et al. Tensile performance of inhomogeneous microscale Cu/Sn-58Bi/Cu solder joints under electro-thermo-mechanical coupled loads [J ] . Journal of Mechanical Engineering , 2022 , 58 ( 2 ): 307 - 320 . (in Chinese) DOI: 10.3901/JME.2022.02.307 http://doi.org/10.3901/JME.2022.02.307 The microscale solder joint in electronic packaging usually serves under the coupled loading of electric current, heat and mechanical stress, which has a distinct inhomogeneous microstructure. Tensile performance of inhomogeneous microscale line-type Cu/Sn-58Bi/Cu solder joints with different current densities and temperatures as well as their size effects are investigated under electro-thermo-mechanical coupled loads. The results show that at low current densities and temperatures, as the height of solder joints decreases, the mechanical constraint of Cu substrate on solder increases, which enhances tensile performance of solder joints; the fracture occurs in solder matrix, showing a ductile fracture mode. These are consistent with the mechanical performance and fracture behaviour of solder joints under tensile load without electric current stressing at room temperature. The local current crowding caused by the non-uniform distribution of current densities in Sn and Bi phases increases the temperature gradient between them. The mismatch strain and stress at the Sn/Bi interface increase due to the difference in coefficient of thermal expansion between Sn and Bi. Therefore, the tensile strength of solder joints under electro-thermo-mechanical coupled loads is lower than that at room temperature without electric current stressing. As the current density and temperature increase, the mismatch strain and stress at the Sn/Bi interface and the solder/IMC layer interface increase, resulting in further decrease in tensile strength of solder joints. Moreover, the fracture location gradually changes from the solder matrix to the solder/IMC layer interface, while the fracture mode shifts from ductile fracture to ductile-brittle mixed fracture.

DANG Y B , SUN Y , HAO Z W , et al. Shock fatigue damage failure boundary study of BGA solder joints based on shock response spectrum [J ] . International Journal of Fatigue , 2024 , 182 : 108214 .

党永斌 . BGA焊点冲击疲劳寿命和损伤失效边界评估方法研究 [D ] . 哈尔滨 : 哈尔滨工业大学 , 2024 .

DANG Y B . Research on shock farigue life anddamage failure boundary assessmentfor bga solder joints [D ] . Harbin : Harbin Institute of Technology , 2024 . (in Chinese)

钞红晓 , 刘奇涛 , 黄宏胜 . 高能效宽脉冲强冲击试验与测试技术 [M ] . 北京 : 科学出版社 , 2024 .

CHAO H X , LIU Q T , HUANG H S . High energy efficiency wide pulse strong impact test and testing technology [M ] . Beijing : Science Press , 2024 . (in Chinese)

刘振 . 冲击载荷作用下芯片封装的板级-整机可靠性研究 [D ] . 长沙 : 中南大学 , 2022 .

LIU Z . Study on board level-product level reliability of chippackaging under drop impact [D ] . Changsha : Central South University , 2022 . (in Chinese)

GUO Y Y , CHEN C , WANG R Z , et al. Macro meso response and stress wave propagation characteristics of MCT high-voltage switch under shock load [J ] . Defence Technology , 2024 , 32 : 317 - 335 .

MUTHURAM N , SARAVANAN S . Free fall drop impact analysis of board level electronic packages [J ] . Microelectronics Journal , 2022 , 129 : 105601 .

XU L X , LI Y Y , LI J H . Analysis of the failure and performance variation mechanism of MEMS suspended inductors with auxiliary pillars under high- g shock [J ] . Micromachines , 2020 , 11 ( 11 ): 957 .

XU L , XU J M , WANG S B , et al. Understanding the impact response of lead-free solder at high strain rates [J ] . International Journal of Mechanical Sciences , 2020 , 172 : 105416 .

刘文博 . 硬目标侵彻引信电路冲击失效机理分析与防护方法研究 [D ] . 南京 : 南京理工大学 , 2021 .

LIU W B . Impact failure mechanism analysis and protection method of hard target penetration fuze circuit [D ] . Nanjing : Nanjing University of Science and Technology , 2021 . (in Chinese)

LIU Z , FANG M G , SHI L , et al. Characteristics of cracking failure in microbump joints for 3D chip-on-chip interconnections under drop impact [J ] . Micromachines , 2022 , 13 ( 2 ): 281 .

CHEN Y J , JING B , LI J F , et al. Failure analysis and modeling of solder joints in BGA packaged electronic chips [J ] . IEEE Transactions on Components,Packaging and Manufacturing Technology , 2020 , 11 ( 1 ): 43 - 50 .

WU M L , LAN J S . Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events [J ] . Microelectronics Reliability , 2018 , 80 : 213 - 222 .

ZHANG B W , SHAN G B , SU F . Impact reliability analysis of a rigid-flex PCB system under acceleration loads [J ] . Microelectronics Reliability , 2021 , 127 : 114374 .

赵玉杰 . 高 g 值冲击下灌封电路系统的动态响应及失效分析 [D ] . 太原 : 中北大学 , 2018 .

ZHAO Y J . Study on dynamic response and failure of the circuit systems under high g value impact [D ] . Taiyuan : North University of China , 2018 . (in Chinese)

SANG T , GHARAIBEH M A , WENTLENT L , et al. Drop and impact reliability investigation of BGA and LGA interconnects [J ] . Soldering & Surface Mount Technology , 2023 , 35 ( 4 ): 244 - 254 .

GU J , LEI Y P , LIN J , et al. The failure models of lead free Sn-3.0Ag-0.5Cu solder joint reliability under low-G and high-G drop impact [J ] . Journal of Electronic Materials , 2017 , 46 : 1396 - 1404 .

吕明涛 , 何虎 . 高加速度载荷下三维堆叠封装冲击可靠性分析 [J ] . 导航与控制 , 2022 , 21 ( 3 ): 181 - 191 ,165.

LÜ M T , HE H . Impact reliability analysis of 3D stacked packaging under high acceleration loads [J ] . Navigation and Control , 2022 , 21 ( 3 ): 181 - 191 ,165. (in Chinese)

LONG Y , LV M T , HE H . Failure mechanism and predictive modeling for microbump interconnects drop life under diverse impact angles in advanced packaging [J ] . IEEE Transactions on Device and Materials Reliability , 2024 , 24 ( 2 ): 241 - 249 .

THUKRAL V , ZAAL J J M , ROUCOU R , et al. Understanding the impact of PCB changes in the latest published JEDEC board level drop test method [C ] //Proceedings of the 2018 IEEE 68th Electronic Components and Technology Conference.San Diego,CA, US:IEEE , 2018 : 756 - 763 .

牛乐毅 . 多物理场作用下焊点电迁移失效机理研究 [D ] . 西安 : 西安电子科技大学 , 2022 .

NIU L Y . Research on electromigration failure mechanism of solder joints under multi-physical fields [D ] . Xi’an : Xidian University , 2022 . (in Chinese)

ZHU Q Y , HUANG Z Y , QIAN H J , et al. Deformation behavior study of SAC305 solder joints under shear and tensile loading by crystal plasticity finite element method [J ] . Microelectronics Journal , 2024 , 154 : 106471 .

SHIH M K , LIU Y H , LEE C , et al. Reliability evaluation of board-level flip-chip package under coupled mechanical compression and thermal cycling test conditions [J ] . Materials , 2023 , 16 ( 12 ): 4291 .

SHIH M K , WU N Y , LAI W H , et al. Board-level drop impact reliability analysis of dual-side molding system-in-package (SiP) modules [J ] . IEEE Transactions on Electron Devices , 2022 , 70 ( 1 ): 215 - 221 .

LIU F , GONG R Z , DUAN Z W , et al. Effect of PCB fastening method and thickness on PCB assembly vibration reliability in thermal environments [J ] . Microelectronics Reliability , 2025 , 165 : 115587 .

BAISHYA K , HARVEY D M , MANZANERA P T , et al. Failure patterns of solder joints identified through lifetime vibration tests [J ] . Nondestructive Testing and Evaluation , 2023 , 38 ( 1 ): 147 - 171 .

刘勇 , 梁利华 , 曲建民 . 微电子器件及封装的建模与仿真 [M ] . 北京 : 科学出版社 , 2010 .

LIU Y , LIANG L H , QU J M . Modeling and simulation of microelectronic devices and packages [M ] . Beijing : Science Press , 2010 . (in Chinese)

李建刚 . 应变率效应对无铅焊锡接点跌落冲击力学行为的影响 [D ] . 北京 : 北京工业大学 , 2009 .

LI J G . Influence of strain rate effect on behavior of solder joints under drop impact loading [D ] . Beijing : Beijing University of Technology , 2009 . (in Chinese)