Low Speed Impact Resistance of Gradient Encapsulated Circuit Board Structure

Xiufang ZHU; Hongyuan ZHOU; Hong ZHANG; Xinmin CHEN

doi:10.12382/bgxb.2023.0949

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Low Speed Impact Resistance of Gradient Encapsulated Circuit Board Structure

更新时间：2025-08-18

- Low Speed Impact Resistance of Gradient Encapsulated Circuit Board Structure
- Acta Armamentarii Vol. 45, Issue 11, Pages: 3879-3891(2024)
- 作者机构：
  
  1. 北京理工大学爆炸科学与安全防护全国重点实验室, 北京 100081
  2. 中国科学院宁波材料技术与工程研究所, 浙江宁波 315201
  3. 北京工业大学教育部城市安全与灾害工程重点实验室, 北京 100124
- 作者简介：
- 基金信息：
- DOI：10.12382/bgxb.2023.0949
  CLC：
- Received：19 September 2023，
  
  Published Online：26 November 2024，
  
  Published：30 November 2024
- 稿件说明：
移动端阅览
Xiufang ZHU, Hongyuan ZHOU, Hong ZHANG, et al. Low Speed Impact Resistance of Gradient Encapsulated Circuit Board Structure[J]. Acta Armamentarii, 2024, 45(11): 3879-3891.
DOI：

Xiufang ZHU, Hongyuan ZHOU, Hong ZHANG, et al. Low Speed Impact Resistance of Gradient Encapsulated Circuit Board Structure[J]. Acta Armamentarii, 2024, 45(11): 3879-3891. DOI： 10.12382/bgxb.2023.0949.

摘要

灌封防护可以增强电子设备的完整性

提高对外部冲击和振动的抵抗力

在汽车、船舶和兵器等领域得到了广泛应用。但传统的均质树脂灌封材料存在韧性不足、抗冲击能力较差的问题。针对这一问题

设计了碳纳米管(Carbon nanotubes

CNT)增强树脂基梯度灌封材料

并开展梯度灌封电路板结构的抗冲击性能研究。基于准静态拉伸试验和动态落锤冲击试验分析了不同CNT含量对树脂基体的增强效果以及不同梯度类型灌封结构的抗冲击性能

并通过有限元仿真得到了灌封层及内部电路板的能量吸收和损伤失效情况。研究结果表明:添加0.7 wt% CNT的灌封材料具有较高的拉伸强度

比纯环氧树脂提高了16%;V型梯度灌封板的冲击强度和临界破坏能量高于其他梯度类型

且比均质板提高了40%和15.8%;灌封材料的缓冲吸能对内部电子元件具有良好的防护作用

并且CNT含量较高的铺层吸能更高。提出的新型梯度灌封方式为冲击环境下的电子元件的防护设计提供了参考。

Abstract

Encapsulating protection has been widely used in automobiles

ships and weapons. It can enhance the integrity of electronic equipment and improve the resistance to external shocks and vibrations. However

the traditional homogeneous resin encapsulating materials have insufficient toughness and poor impact resistance. In response to this issue

this paper designs the resin gradient encapsulated materials reinforced with carbon nanotube (CNT) and studies the impact resistance of gradient encapsulated circuit board structure. The enhancing effects of different CNT contents on resin matrix and the impact resistance of gradient encapsulated structures are analyzed through quasi-static tensile tests and dynamic drop hammer impact tests. The energy absorptions of different gradient layers are obtained and the damage and failure of internal circuit boards are evaluated through finite element simulation analysis. The research results show that the encapsulating material with 0.7wt % CNT exhibits a higher tensile strength

which is 16% higher than that of pure epoxy resin; The impact strength and critical failure energy of V-shaped encapsulated gradient plate are higher than those of other gradient types

and are increased by 40% and 15.8%

respectively

compared to the homogeneous plate. The buffering and energy absorption properties of the encapsulating materials have a positive impact on the protection of internal electronic components

with the gradient layer containing a higher CNT content exhibiting an increased energy absorption. The gradient encapsulation method proposed in this paper provides a reference for the protection design of electronic components under impact environment.

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references

任辉启 , 穆朝民 , 刘瑞朝 , 等 . 精确制导武器侵彻效应与工程防护 [M ] . 北京 : 科学出版社 , 2016 .

REN H Q , MU C M , LIU R C , et al. Penetration effects of precision guided weapons and engineering protection [M ] . Beijing : Science Press , 2016 . (in Chinese)

焦敏 . 高冲击环境下弹载引信灌封层对系统的防护分析和仿真研究 [D ] . 绵阳 : 中国工程物理研究院 , 2014 .

JIAO M . Protection analysis and numerical simulation on potting-layer in fuze under high-impact penetration circumstances [D ] . Mianyang : China Academy of Engineering Physics , 2014 . (in Chinese)

尹威华 , 杨国来 , 葛建立 , 等 . 弹载测试电路模块缓冲防护结构设计及优化 [J ] . 火炮发射与控制学报 , 2016 , 37 ( 3 ): 56 - 60 .

YIN W H , YANG G L , GE J L , et al. Design and optimization of cushioning and protective structure for a circuit module of projectile-borne testing equipment [J ] . Journal of Gun Launch & Control , 2016 , 37 ( 3 ): 56 - 60 . (in Chinese)

TONG X C . Advanced materials for thermal management of electronic packaging [M ] . New York, NY , US : Springer , 2011 .

佟辉 , 臧丽坤 , 徐菊 . 导热绝缘材料在电力电子器件封装中的应用 [J ] . 绝缘材料 , 2021 , 54 ( 12 ): 1 - 9 .

TONG H , ZANG L K , XU J . Application of thermally conductive insulating materials in power electronics packaging [J ] . Insulating Materials , 2021 , 54 ( 12 ): 1 - 9 . (in Chinese)

关亚男 , 王广奇 . 微电路模块灌封工艺研究 [J ] . 微处理机 , 2021 , 42 ( 1 ): 23 - 26 .

GUAN Y N , WANG G Q . Study on potting process of microcircuit module [J ] . Microprocessors , 2021 , 42 ( 1 ): 23 - 26 . (in Chinese)

曹军生 , 伍思豫 , 向豪 , 等 . 橡胶增韧环氧树脂的研究进展 [J ] . 特种橡胶制品 , 2023 , 44 ( 1 ): 58 - 62 .

CAO J S , WU S Y , XIANG H , et al. Research progress of rubber toughened epoxy resin [J ] . Special Purpose Rubber Products , 2023 , 44 ( 1 ): 58 - 62 . (in Chinese)

鲁林 , 李晓峰 . 冲击环境作用下聚氨酯材料的应变率分布及吸能特性研究 [J ] . 兵工学报 , 2015 , 36 ( 增刊1 ): 213 - 219 .

LU L , LI X F . Research on strain rate distribution and energy absorption of polyurethane materials under shock environment [J ] . Acta Armamentarii , 2015 , 36 ( S1 ): 213 - 219 . (in Chinese)

GUAN Q B , YUAN L , ZHANG Y , et al. Improving the mechanical, thermal, dielectric and flame retardancy properties of cyanate ester with the encapsulated epoxy resin penetrated aligned carbon nanotube bundle [J ] . Composites Part B: Engineering , 2017 , 123 ( 1 ): 81 - 91 .

WANG J H , LIANG G Z , YAN H X . Mechanical and thermal properties of functionalized multiwalled carbon nanotubes/cyanate ester composite [J ] . Polymer Engineering and Science , 2009 , 49 ( 4 ): 680 - 684 .

PARK J H , BAEK S D , CHO J I , et al. Characteristics of transparent encapsulation materials for OLEDs prepared from mesoporous silica nanoparticle-polyurethane acrylate resin composites [J ] . Composites Part B: Engineering , 2019 , 175 : 107188 .

CHAKKA V , TRABIA M B , O’TOOLE B , et al. Modeling and reduction of shocks on electronic components within a projectile [J ] . International Journal of Impact Engineering , 2008 , 35 ( 11 ): 1326 - 1338 .

李芝华 , 林伟 , 谢科予 , 等 . 玻璃纤维填充聚氨酯改性环氧树脂灌封材料的性能 [J ] . 高分子材料科学与工程 , 2009 , 25 ( 9 ): 47 - 49 .

LI Z H , LIN W , XIE K Y , et al. Properties of polyurethane-modified epoxy resin encapsulating materials filled with glass fiber [J ] . Polymer Materials Science and Engineering , 2009 , 25 ( 9 ): 47 - 49 . (in Chinese)

PANDER P M , RATHEE S , SRIVASTAVA M , et al. Functionally graded materials (FGMs):fabrication, properties, applications, and advancements [M ] . Boca Raton, FL , US : CRC Press , 2021 .

SALEH B , JIANG J H , FATHI R , et al. 30 years of functionally graded materials: an overview of manufacturing methods, applications and future challenges [J ] . Composites Part B: Engineering , 2020 , 201 : 108376 .

SELIM B A , YIN B B , LIEW K M . Impact analysis of CNT-reinforced composite plates integrated with piezoelectric layers based on Reddy’s higher-order shear deformation theory [J ] . Composites Part B: Engineering , 2018 , 136 : 10 - 19 .

AKHAVANALAVI S M , MOHAMMADIMEHR M , EDJTAHED S H . Active control of micro reddy beam integrated with functionally graded nanocomposite sensor and actuator based on linear quadratic regulator method [J ] . European Journal of MechanicsA-Solids , 2019 , 74 : 449 - 461 .

DI SCIUVA M , SORRENTI M . Bending, free vibration and buckling of functionally graded carbon nanotube-reinforced sandwich plates, using the extended Refined Zigzag Theory [J ] . Composite Structures , 2019 , 227 : 111324 .

SAFAEI B , MORADI-DASTJERDI R , BEHDINAN K , CHU F L . Critical buckling temperature and force in porous sandwich plates with CNT-reinforced nanocomposite layers [J ] . Aerospace Science and Technology , 2019 : 91 : 175 - 185 .

DAGHIGH H , DAGHIGH V , MILANI A , et al. Nonlocal bending and buckling of agglomerated CNT-Reinforced composite nanoplates [J ] . Composites Part B: Engineering , 2020 , 183 : 107716 .

ZHANG L W , XIAO L N , ZOU G L , et al. Elastodynamic analysis of quadrilateral CNT-reinforced functionally graded composite plates using FSDT element-free method [J ] . Composite Structures , 2016 , 148 : 144 - 154 .

JAM J E , KIANI Y . Low velocity impact response of functionally graded carbon nanotube reinforced composite beams in thermal environment [J ] . Composite Structures , 2015 , 132 : 35 - 43 .

ZHANG L W , SONG Z G , QIAO P , et al. Modeling of dynamic responses of CNT reinforced composite cylindrical shells under impact loads [J ] . Computer Methods in Applied Mechanics and Engineering , 2016 , 313 : 889 - 903 .

徐萧 , 高世桥 , 牛少华 , 等 . 灌封材料对侵彻过载下弹体器件的防护分析 [J ] . 兵工学报 , 2017 , 38 ( 7 ): 1289 - 1300 . DOI: 10.3969/j.issn.1000-1093.2017.07.006 http://doi.org/10.3969/j.issn.1000-1093.2017.07.006 为研究在灌封材料缓冲保护下弹载器件对冲击载荷的动态响应，利用LS-DYNA用户材料自定义程序UMAT二次开发平台，编写朱-王-唐（ZWT）非线性黏弹性本构模型的材料子程序，并将ZWT模型应用于弹体内部灌封材料的动态仿真。通过调整ZWT模型的非线性弹性模量、低应变率Maxwell单元的弹性常数、高应变率Maxwell单元的弹性常数、高应变率Maxwell单元的松弛时间和材料密度，得出不同参数对应下，弹体内部电子器件不同的动力学响应，并分析灌封材料各参数变化对于弹体内部电子器件响应造成的影响。研究结果表明：当非线性弹性模量、低应变率Maxwell单元的弹性常数、高应变率Maxwell单元的松弛时间和材料密度的数值降低时，灌封材料的减振和防护效果更佳。根据仿真结果提出了针对不同工程需求的材料优化方案。

XU X , GAO S Q , NIU S H , et al. Dynamic analysis of projectileborne electronic devices under impact loading [J ] . Acta Armamentarii , 2017 , 38 ( 7 ): 1289 - 1300 . (in Chinese)

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