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中北大学 材料科学与工程工程学院, 山西 太原 030051
Received:18 April 2023,
Published Online:12 January 2024,
Published:30 December 2023
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Yu WANG, Shule BAI, Ziqi WANG, et al. Design of Layered Metal Embedded Stress Sensing Structure and Testing of Microstructure and Properties in Ultrasonic Additive Manufacturing[J]. Acta Armamentarii, 2023, 44(12): 3783-3792.
Yu WANG, Shule BAI, Ziqi WANG, et al. Design of Layered Metal Embedded Stress Sensing Structure and Testing of Microstructure and Properties in Ultrasonic Additive Manufacturing[J]. Acta Armamentarii, 2023, 44(12): 3783-3792. DOI: 10.12382/bgxb.2023.0349.
针对传统贴片式测试精度低、难以检测金属结构内部应力问题
提出一种振膜式层状金属内嵌应力感知结构。从振膜层厚度、振膜材质等方面进行材料选型和结构设计
采用超声波增材制造方式对铜/铝层状振膜结构进行增材制造
研究超声波固结后振膜/基体界面的互扩散、相组成及微观组织
采用有限元冲击仿真对传统贴片式结构和制造获得的层状内嵌应力感知结构进行应变模拟
对层状内嵌应力感知结构进行应变测试
研究层状金属内嵌应力感知结构的应变响应效果。研究结果表明:振膜层设计所得振膜形状为圆形膜
薄膜材料为纯铜
薄膜直径为20mm
薄膜厚度为0.1mm;超声波增材制造铜膜/铝基体之后
铜原子向铝层发生少量扩散但不产生新的金属间化合物
形成机械结合的齿合形貌。冲击仿真和应变测试结果均表明内嵌应力感知结构的应变响应效果比传统贴片式结构的应变响应效果精确。
A diaphragm type layered metal embedded stress sensing structure is proposed to address the issues of low accuracy and difficulty in detecting the internal stresses in metal structures using traditional patch testing. Material selection and structural design are carried out from aspects of the thickness of diaphragm layer and the material of diaphragm. Ultrasonic additive manufacturing is used to manufacture Cu/Al layered diaphragm structures. The mutual diffusion
phase composition
and microstructure of the diaphragm/substrate interface after ultrasonic consolidation are studied. Finite element impact simulation is used to simulate the strain of traditional patch structures and the layered embedded stress sensing structures obtained from manufacturing
Strain testing is conducted on layered embedded stress sensing structures to investigate the strain response effect of layered metal embedded stress sensing structures. The research results indicate that the shape of diaphragm designed by the diaphragm layer is a circular membrane
of which the film material is a pure copper with a film diameter of 20mm and a film thickness of 0.1mm. After ultrasonic additive manufacturing of Cu film/Al matrix
a small amount of Cu atoms diffuse towards the Al layer without generating new intermetallic compounds
forming a mechanically bonded toothed morphology. The results of impact simulation and strain testing both indicate that the strain response effect of the embedded stress sensing structure is more accurate than that of the traditional patch structure.
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