Study of Direct-write Additive-based Laminated 3D Electrical Interconnection Structure of Fuze

doi:10.12382/bgxb.2025.0532

Abstract

Abstract:

The heterogeneous electrical interconnections of microminiature fuzes are a key issue that restricts the further reduction of volume to realize higher density integration.A laminated 3D electrical interconnection structure for fuzes based on additive manufacturing technology is proposed to improve the space utilization rate of electrical interconnections in the process of fuzes miniaturization，and the feasibility of the interconnection structure is verified through performance simulation analysis，prototype preparation，and multidimensional and multi-environmental tests.The results show that the laminated 3D electrical interconnection structure realizes the graphical，high-density，and highly integrated electrical interconnection through vertical stacking，which reduces or even eliminates the gap between circuits and electronic devices，and significantly improves the space utilization rate and connection efficiency； after integrating with the fuze ignition control circuit，the overall height of the structure is reduced by about 80% compared with the traditional pin connection，while the resistance is only 0.018Ω.After -54-71℃ thermal shock test，wheeled vehicle transportation vibration test，55000g high-impact overload test and other extreme environmental tests，the the microscopic images of vertical through-hole and horizontal trace show that the structure is undamaged.Tthe detonation performance test shows that the electrical performance of ignition control module is intact，its structural performance and electrical performance are reflected in the high reliability.

Key words: microminiature fuze, agile manufacturing, 3D electrical interconnection, 3D direct writing technology, environmental test

LI Shiyi, LOU Wenzhong, FENG Hengzhen, KAN Wenxing, LÜ Sining, XIAO Chuan, REN Jie. Study of Direct-write Additive-based Laminated 3D Electrical Interconnection Structure of Fuze[J]. Acta Armamentarii, 2025, 46(S1): 250532-.

Figures/Tables 24

Fig.1 Structure comparison

Fig.2 Printing preparation process

Fig.3 Printing preparation process

Fig.4 Electric performance test of electrical interconnection structures

Fig.5 Analysis of microscopic properties of 3D direct writing materials

Fig.6 Thermal shock temperature profile

Fig.7 Thermal shock analysis of electrical interconnection structures

Table 1 Stress and strain results for solder balls，solder posts-pads，and traces

阶段	时间/s	应力/MPa	形变/mm
第1次循环	7200	82.60	5.34×10^-3
	21600	53.26	3.44×10^-3
	28800	53.26	8.08×10^-4
第2次循环	36000	82.60	5.34×10^-3
	50400	53.26	3.44×10^-3
	57600	53.26	8.08×10^-4
第3次循环	64800	82.60	5.34×10^-3
	79200	53.26	3.44×10^-3
	86400	53.26	8.08×10^-4
恒温保存	115200	1.09	7.03×10^-5
试验结束	144000	2.20	7.03×10^-5

Fig.8 Stress and strain analyses of solder balls，solder posts-pads，and traces at 115200s

Fig.9 Thermal shock test platform

Fig.10 Electrical interconnection structure after thermal shock test

Fig.11 Micrograph of critical parts of electrical interconnection structure after test

Fig.12 Modal analysis of electrical interconnection structure

Table 2 Vibration parameters

频率转折点/ Hz	加速度谱密度/ （g²·Hz^-1）	频率转折点/ Hz	加速度谱密度/ （g²·Hz^-1）	频率转折点/ Hz	加速度谱密度/ （g²·Hz^-1）
5	0.12765	12	0.1	125	0.004
6	0.12926	14	0.15	190	0.004
7	0.3	16	0.15	211	0.006
8	0.3	19	0.04	440	0.006
9	0.1	90	0.006	500	0.00204

Fig.13 Z-directional 1σ stress and strain analysis of critical parts of electrical interconnection structure

Fig.14 Vibration test bench

Fig.15 Vibration test power spectral density curve

Fig.16 Micrograph of critical parts of electrical interconnection structure after test

Fig.17 Overload impact analysis of electrical interconnection structure

Fig.18 Stress and strain analyses of each electrical interconnection structure under shock loading

Fig.19 Machette drop hammer test platform

Fig.20 Machette drop hammer test bench

Fig.21 Micrograph of critical parts of electrical interconnection structure after test

Fig.22 Electrical performance of electrical interconnection structure after test

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