基于直写增材的引信层叠式3D电气互联结构

doi:10.12382/bgxb.2025.0532

摘要/Abstract

摘要：

微小型引信异质异构（不同材料、结构）电气互联（电性能连接），是制约体积进一步缩小，实现更高密度集成的关键问题。针对引信小型化过程中电气互联空间利用率低的问题，提出了一种基于增材制造技术的引信层叠式3D电气互联结构，并通过性能仿真分析、样件制备及多维度、多环境试验验证了该结构的可行性。研究结果表明，层叠式3D电气互联结构通过垂直堆叠实现图形化、高密度、高集成度的电气互联，减小甚至消除电路与电子器件之间的间隙，显著提升空间利用率与连接效率；与引信发火控制电路集成后，相较于传统插针连接，整体结构高度降低约80%，同时电阻仅为0.018Ω；历经-54~71℃的热冲击试验、轮式车辆运输振动试验、55000g高冲击过载试验等极端环境下，垂直通孔与水平迹线的显微图像显示结构未损坏，发火控制模块起爆性能测试显示电性能完好，结构性能与电性能均体现出了高可靠性。

关键词: 微小型引信, 敏捷制造, 3D电气互联, 3D直写技术, 环境试验

Abstract:

The heterogeneous electrical interconnections of microminiature fuzes are a key issue that restricts the further reduction of volume to realize higher density integration.A laminated 3D electrical interconnection structure for fuzes based on additive manufacturing technology is proposed to improve the space utilization rate of electrical interconnections in the process of fuzes miniaturization，and the feasibility of the interconnection structure is verified through performance simulation analysis，prototype preparation，and multidimensional and multi-environmental tests.The results show that the laminated 3D electrical interconnection structure realizes the graphical，high-density，and highly integrated electrical interconnection through vertical stacking，which reduces or even eliminates the gap between circuits and electronic devices，and significantly improves the space utilization rate and connection efficiency； after integrating with the fuze ignition control circuit，the overall height of the structure is reduced by about 80% compared with the traditional pin connection，while the resistance is only 0.018Ω.After -54-71℃ thermal shock test，wheeled vehicle transportation vibration test，55000g high-impact overload test and other extreme environmental tests，the the microscopic images of vertical through-hole and horizontal trace show that the structure is undamaged.Tthe detonation performance test shows that the electrical performance of ignition control module is intact，its structural performance and electrical performance are reflected in the high reliability.

Key words: microminiature fuze, agile manufacturing, 3D electrical interconnection, 3D direct writing technology, environmental test

李诗怡, 娄文忠, 冯恒振, 阚文星, 吕斯宁, 肖川, 任杰. 基于直写增材的引信层叠式3D电气互联结构[J]. 兵工学报, 2025, 46(S1): 250532-.

LI Shiyi, LOU Wenzhong, FENG Hengzhen, KAN Wenxing, LÜ Sining, XIAO Chuan, REN Jie. Study of Direct-write Additive-based Laminated 3D Electrical Interconnection Structure of Fuze[J]. Acta Armamentarii, 2025, 46(S1): 250532-.

图/表 24

图1 结构对比

Fig.1 Structure comparison

图2 打印制备流程

Fig.2 Printing preparation process

图3 打印制备流程

Fig.3 Printing preparation process

图4 电气互联结构电性能测试

Fig.4 Electric performance test of electrical interconnection structures

图5 DIW材料微观性能分析

Fig.5 Analysis of microscopic properties of 3D direct writing materials

图6 热冲击温度曲线

Fig.6 Thermal shock temperature profile

图7 电气互联结构热冲击分析云图

Fig.7 Thermal shock analysis of electrical interconnection structures

表1 焊球、焊柱-焊盘、迹线的应力、应变结果

Table 1 Stress and strain results for solder balls，solder posts-pads，and traces

阶段	时间/s	应力/MPa	形变/mm
第1次循环	7200	82.60	5.34×10^-3
	21600	53.26	3.44×10^-3
	28800	53.26	8.08×10^-4
第2次循环	36000	82.60	5.34×10^-3
	50400	53.26	3.44×10^-3
	57600	53.26	8.08×10^-4
第3次循环	64800	82.60	5.34×10^-3
	79200	53.26	3.44×10^-3
	86400	53.26	8.08×10^-4
恒温保存	115200	1.09	7.03×10^-5
试验结束	144000	2.20	7.03×10^-5

图8 第115200s焊球、焊柱-焊盘、迹线的应力、应变分布云图

Fig.8 Stress and strain analyses of solder balls，solder posts-pads，and traces at 115200s

图9 热冲击试验平台

Fig.9 Thermal shock test platform

图10 电气互联件热冲击试验后效果

Fig.10 Electrical interconnection structure after thermal shock test

图11 电气互联结构试验后关键部位显微图

Fig.11 Micrograph of critical parts of electrical interconnection structure after test

图12 电气互联结构模态分析

Fig.12 Modal analysis of electrical interconnection structure

表2 振动参数

Table 2 Vibration parameters

频率转折点/ Hz	加速度谱密度/ （g²·Hz^-1）	频率转折点/ Hz	加速度谱密度/ （g²·Hz^-1）	频率转折点/ Hz	加速度谱密度/ （g²·Hz^-1）
5	0.12765	12	0.1	125	0.004
6	0.12926	14	0.15	190	0.004
7	0.3	16	0.15	211	0.006
8	0.3	19	0.04	440	0.006
9	0.1	90	0.006	500	0.00204

图13 电气互联结构关键部位Z向1σ应力、应变分析

Fig.13 Z-directional 1σ stress and strain analysis of critical parts of electrical interconnection structure

图14 振动测试平台

Fig.14 Vibration test bench

图15 振动试验功率谱密度曲线

Fig.15 Vibration test power spectral density curve

图16 电气互联结构试验后关键部位显微图

Fig.16 Micrograph of critical parts of electrical interconnection structure after test

图17 电气互联结构过载冲击分析

Fig.17 Overload impact analysis of electrical interconnection structure

图18 冲击过载下各结构应力、应变情况

Fig.18 Stress and strain analyses of each electrical interconnection structure under shock loading

图19 马歇特落锤测试平台

Fig.19 Machette drop hammer test platform

图20 马歇特落锤测试平台

Fig.20 Machette drop hammer test bench

图21 电气互联结构试验后关键部位显微图

Fig.21 Micrograph of critical parts of electrical interconnection structure after test

图22 试验后电气互联结构电气性能测试

Fig.22 Electrical performance of electrical interconnection structure after test

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