层状金属内嵌应力感知结构设计及超声波增材制造组织性能测试

doi:10.12382/bgxb.2023.0349

摘要/Abstract

摘要：

针对传统贴片式测试精度低、难以检测金属结构内部应力问题,提出一种振膜式层状金属内嵌应力感知结构。从振膜层厚度、振膜材质等方面进行材料选型和结构设计,采用超声波增材制造方式对铜/铝层状振膜结构进行增材制造,研究超声波固结后振膜/基体界面的互扩散、相组成及微观组织,采用有限元冲击仿真对传统贴片式结构和制造获得的层状内嵌应力感知结构进行应变模拟,对层状内嵌应力感知结构进行应变测试,研究层状金属内嵌应力感知结构的应变响应效果。研究结果表明:振膜层设计所得振膜形状为圆形膜,薄膜材料为纯铜,薄膜直径为20mm,薄膜厚度为0.1mm;超声波增材制造铜膜/铝基体之后,铜原子向铝层发生少量扩散但不产生新的金属间化合物,形成机械结合的齿合形貌。冲击仿真和应变测试结果均表明内嵌应力感知结构的应变响应效果比传统贴片式结构的应变响应效果精确。

关键词: 结构设计, 超声波增材制造, 界面研究, 冲击仿真

Abstract:

A diaphragm type layered metal embedded stress sensing structure is proposed to address the issues of low accuracy and difficulty in detecting the internal stresses in metal structures using traditional patch testing. Material selection and structural design are carried out from aspects of the thickness of diaphragm layer and the material of diaphragm. Ultrasonic additive manufacturing is used to manufacture Cu/Al layered diaphragm structures. The mutual diffusion, phase composition, and microstructure of the diaphragm/substrate interface after ultrasonic consolidation are studied. Finite element impact simulation is used to simulate the strain of traditional patch structures and the layered embedded stress sensing structures obtained from manufacturing, Strain testing is conducted on layered embedded stress sensing structures to investigate the strain response effect of layered metal embedded stress sensing structures. The research results indicate that the shape of diaphragm designed by the diaphragm layer is a circular membrane, of which the film material is a pure copper with a film diameter of 20mm and a film thickness of 0.1mm. After ultrasonic additive manufacturing of Cu film/Al matrix, a small amount of Cu atoms diffuse towards the Al layer without generating new intermetallic compounds, forming a mechanically bonded toothed morphology. The results of impact simulation and strain testing both indicate that the strain response effect of the embedded stress sensing structure is more accurate than that of the traditional patch structure.

Key words: structural design, ultrasonic additive manufacturing, interface research, impact simulation

中图分类号:

TG453⁺.9

王宇, 白舒乐, 王子琪, 刘斌, 冯立, 赵文娟, 郝俊辉. 层状金属内嵌应力感知结构设计及超声波增材制造组织性能测试[J]. 兵工学报, 2023, 44(12): 3783-3792.

WANG Yu, BAI Shule, WANG Ziqi, LIU Bin, FENG Li, ZHAO Wenjuan, HAO Junhui. Design of Layered Metal Embedded Stress Sensing Structure and Testing of Microstructure and Properties in Ultrasonic Additive Manufacturing[J]. Acta Armamentarii, 2023, 44(12): 3783-3792.

图/表 21

表1 1060铝、工业纯钛、纯铜的参数

Table 1 Parameters of 1060 aluminum, industrial pure titanium and, pure copper

名称	密度/ (kg·m^-3)	杨氏模量/GPa	剪切模量/GPa	体积模量/GPa	泊松比
1060铝	2770	71	26.692	69.608	0.33
工业纯钛	4620	120	35.294	114.29	0.36
纯铜	8900	110	41.045	114.58	0.34

表2 BF120-3AA150应变片参数

Table 2 BF120-3AA150 strain gauge parameters

参数	数值
应变片尺寸(长×宽)/mm	6.9×3.9
栅丝尺寸(长×宽) /mm	3.0×2.0
应变片厚度/mm	0.02
应变片阻值/Ω	120
灵敏度/(mV·V^-1)	2.0
室温应变最值/(μm·m^-1)	20000
应变片材料	改性酚醛
栅丝材料	康铜箔,全封闭结构
适应温度/℃	-30~80

图1 固有频率和应力分布模态分析

Fig.1 Modal analysis of natural frequency and stress distribution

图2 两种形状振膜的频响曲线

Fig.2 Frequency response curves of two types of diaphragms

图3 不同材料圆形振膜的频响曲线

Fig.3 Frequency response curves of circular diaphragms of different materials

表3 材料振膜的谐振频率

Table 3 The first-order resonant frequencies of diaphragms of three materials Hz

材料	理论计算值	有限元仿真值
1060铝	5077	5080
工业纯钛	4637	4640
纯铜	3667	3670

图4 不同直径圆形振膜的频响曲线

Fig.4 Frequency response curves of three circular diaphragms with different diameters

图5 应变片粘贴模型

Fig.5 Strain gauge paste model

表4 振膜形状、材料、规格参数

Table 4 Film shape, material, specification parameters of diaphragm

序号	名称	参数
1	形状类型	圆形
2	材料	铜
3	直径/mm	20
4	厚度/mm	0.1

图6 应变片粘贴模型

Fig.6 Strain gauge paste model

图7 构件设计图

Fig.7 Component design drawing

图8 内嵌应力感知结构不同样式3D图

Fig.8 3D diagram of different styles of embedded stress sensing structure

图9 层状金属内嵌应力感知结构样品

Fig.9 Layered metal embedded stress sensing structural samples

图10 界面扫描

Fig.10 Interface scan

图11 放大倍数扫描

Fig.11 Magnification scan

图12 贴片式整体结构

Fig.12 Patch type overall structure

图13 仿真几何网格模型

Fig.13 Simulation geometric mesh model

图14 受载荷后结构的微应变云图

Fig.14 Micro-strain cloud diagram of structure after loading

图15 不同结构微应变

Fig.15 Micro-strain curves of different structures

图16 应变片电压测量图

Fig.16 Strain gauge voltage measurement diagram

图17 不同载荷的电压变化波形图

Fig.17 Voltage waveforms of different loads

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